http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
Materials and Fabrication Processes for Transient and Bioresorbable High‐Performance Electronics
Hwang, Suk‐,Won,Kim, Dae‐,Hyeong,Tao, Hu,Kim, Tae‐,il,Kim, Stanley,Yu, Ki Jun,Panilaitis, Bruce,Jeong, Jae‐,Woong,Song, Jun‐,Kyul,Omenetto, Fiorenzo G.,Rogers, John. A. WILEY‐VCH Verlag 2013 Advanced functional materials Vol.23 No.33
<P><B>Abstract</B></P><P>Materials and fabrication procedures are described for bioresorbable transistors and simple integrated circuits, in which the key processing steps occur on silicon wafer substrates, in schemes compatible with methods used in conventional microelectronics. The approach relies on an unusual type of silicon on insulator wafer to yield devices that exploit ultrathin sheets of monocrystalline silicon for the semiconductor, thin films of magnesium for the electrodes and interconnects, silicon dioxide and magnesium oxide for the dielectrics, and silk for the substrates. A range of component examples with detailed measurements of their electrical characteristics and dissolution properties illustrate the capabilities. In vivo toxicity tests demonstrate biocompatibility in sub‐dermal implants. The results have significance for broad classes of water‐soluble, “transient” electronic devices.</P>