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ZnO Nano-particle-reinforced Sn58Bi Low Temperature Solder for Flexible Display Application
Jang Baeg Kim(김장백),Sri Harini Rajendran(라젠드란 스리 하리니),Hye Jun Kang(강혜준),Jae Pil Jung(정재필) 대한용접·접합학회 2021 대한용접학회 특별강연 및 학술발표대회 개요집 Vol.2021 No.5
With the WEEE (2012-19-EU) and RoHS (2002-95-EU) implementation, series of lead-free solders has been developed to meet the demands for various temperature ranges. Sn-58Bi solder is an interesting low-temperature candidate which meets the environmental standards of consumer electronics with good structural and mechanical reliability. However, presence of coarse Bi phase remains a serious concern in terms of mechanical reliability. Many methods have been adopted by the researches to enhance the reliability of Sn-Bi solders such as micro-alloying and the addition of second phase nanoparticles. Whereas nanoparticles are found to enhance the mechanical properties to a greater extent. The Sn58Bi low temperature solder can be applied to flexible display application. In the present work, ZrO2 nanoparticles were used as an additive in Sn-58Bi solder. The microstructure and spreading of Sn58Bi nanocomposite solder have been characterized by Scanning electron microscope and spreading test. Addition of ZnO nanoparticles is found to reduce the Sn-Bi interphase spacing and enhanced the spreading kinetics of Sn58Bi solder. Also, nanoparticles enhanced the tensile strength of Sn58Bi solder by dispersion strengthening. Ductility of Sn58Bi solder is enhanced for lower ZnO additions with dominant bulge fracture. However, at higher additions fracture surface is dominated by cleavage fracture.
김장백,서성민,강혜준,조도훈,스리 하리니 라젠드란,정재필,Kim, Jang Baeg,Seo, Seong Min,Kang, Hye Jun,Cho, Do Hoon,Rajendran, Sri Harini,Jung, Jae Pil 한국마이크로전자및패키징학회 2021 마이크로전자 및 패키징학회지 Vol.28 No.1
Sn-3wt%Ag-0.5wt%Cu (SAC305) solder is most popular solder in electronics industry. However, SAC305 has also drawbacks such as growth of β-Sn phase, intermetallic compounds (IMCs) of Ag3Sn, Cu6Sn5 and Cu3Sn which can result in deterioration of solder joints in terms of metallurgically, mechanically and electrically. Thus, improvement of SAC305 solders have been investigated continuously by addition of alloying elements, nano-particles and etc. In this paper, recent improvements of SAC solders including nano-composite alloys and related solderabilty and metallurgical and mechanical properties are investigated.
TSV (Through-Si-Via) 기술을 이용한 반도체의 3차원 적층 실장
조도훈(Do Hoon Cho),강혜준(Hye Jun Kang),서성민(Seong Min Seo),김장백(Jang Baeg Kim),스리하리니 라젠드란(Sri Harini Rajendran),정재필(Jae Pil Jung) 대한용접·접합학회 2021 대한용접·접합학회지 Vol.39 No.3
Recently, the electronics industry is developing toward artificial intelligence, the Internet of things, fifth-generation technology, and high-performance computing. High-density electronics packaging, high speed, high performance, and miniaturized size are required to satisfy these trends. Three-dimensional Si-chip stacking using through-Si via (TSV) has attracted the attention of industries related to these requirements. In this study, TSV fabrication using the deep reactive ion-etching process and the coating of functional layers on the TSV wall, such as insulating, adhesion, and seed layers, were investigated. In addition, Cu electroplating in the TSV was analyzed in detail. The solutions to other accompanied technical barriers for packaging high-density electronics can improve smartness and convenience.