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- 저자 : Chenlin Li (검색결과 5 건)
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Chenlin Li,Ye Pan,Tao Lu,Lijun Jing,Jinhong Pi 대한금속·재료학회 2018 METALS AND MATERIALS International Vol.24 No.5
The effects of Ti and La additions on the microstructures and mechanical properties of B-refined and Sr-modifi ed Al–11Sialloys were investigated in the present work. The interactions among Ti, La, B and Sr elements were discussed employingmicrostructure observation, thermal analysis and tensile test, respectively. It was found that the addition of 0.05 wt% Binduces a transformation of eutectic Si from fi nely fi brous to coarsely plate-like morphology in the Al–11Si alloy with 0.02wt%Sr modifi cation, owing to the poisoning of IIT mechanism, and the eutectic Si grows only with TPRE mechanism. Bothtitanium and lanthanum can neutralize the co-poisoning effect between Sr and B in the Al–11Si alloy, but the neutralizingeffect of La is dependent on the addition sequence. The combinative addition of La and B elements promotes the effectiverefi nement of α-Al grains, but an inhomogeneous modifi cation of eutectic Si phases is also observed, leading to a slightlydecrease in the elongation.
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Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing
Xundi Zhang,Chenlin Yang,Yumei Zhang,Anmin Hu,Ming Li,Liming Gao,Huiqin Ling,Tao Hang 대한금속·재료학회 2020 ELECTRONIC MATERIALS LETTERS Vol.16 No.4
Ultra-thin wafer fabrication has become a hot spot in recent years with the growing demand for small size and high performance electronic devices. However, far less research focused on the damage behavior in ultra-thin wafer. In this work, 300 mm diameter silicon wafer was thinned to 6 µm thick by grinding plus ultra-precision dry polishing. The damage behavior before and after the dry polishing was discussed. Mechanical and surface analysis showed that the dry polishing process can help improve the strength and surface uniformity of ultra-thin wafer by removing high pressure phase and micro cracks. Series of nano beam diffraction patterns revealed the stress induced by the thinning process only existed in surface. High resolution transmission electron microscopy images analyzed by geometric phase approach indicated that surface dislocations can move across the wafer and reached bottom device layers during the dry polishing, increasing the risk of electrical deterioration. The findings are of great significance to the study on process optimization of ultra-thin wafer and provide insights into the reliability of advanced electronic packaging.
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Lightweight fault diagnosis method in embedded system based on knowledge distillation
Ran Gong,Chenlin Wang,Jinxiao Li,Yi Xu 대한기계학회 2023 JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY Vol.37 No.11
Deep learning (DL) has garnered attention in mechanical device health management for its ability to accurately identify faults and predict component life. However, its high computational cost presents a significant challenge for resource-limited embedded devices. To address this issue, we propose a lightweight fault diagnosis model based on knowledge distillation. The model employs complex residual networks with high classification accuracy as teachers and simple combinatorial convolutional networks as students. The student model has a similar structure to the teacher model, with fewer layers, and uses pixel-wise convolution and channel-wise convolution instead of the original convolution. Students learn the probability distribution rule of the output layer of teacher models to enhance their fault classification accuracy and achieve model compression. This process is called knowledge distillation. The combination of a lightweight model structure and the model training method of knowledge distillation results in a model that not only achieves higher classification accuracy than other small-sized classical models, but also has faster inference speed in embedded devices.
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Yaqian Sun,Jing Wang,Xundi Zhang,Chenlin Yang,Anmin Hu,Tao Hang,Yunwen Wu,Huiqin Ling,Ming Li 대한금속·재료학회 2021 ELECTRONIC MATERIALS LETTERS Vol.17 No.6
At present, thermal compression bonding based on Cu and lead-free Sn based solder is often limited by high bonding temperature,which is higher than the melting point of solder (218 ℃). In this paper, we reported a low-temperature solid stateinsertion bonding method based on electroless Cu-Co-P micro-cones array. By adjusting the mass ratio of CuSO 4 ·5H 2 O andCoSO 4 ·7H 2 O, a series of Cu-Co-P micro-cones with diff erent morphologies were prepared. The Cu-Co-P micro-cones withhigher proportion of copper were sharper and denser and (111) orientation was also more. It was found that reducing theheight and density of micro-cones was conducive to achieve seamless bonding at lower temperature and force such as 170℃ and 750 gf. By optimizing the morphology of micro-cones, such as height, bottom diameter, vertex angle and density, theseamless and reliable bonding with high shear strength (39.9 MPa) could be achieved at 170 ℃ bonding temperature and1000 gf bonding force. The transmission electron microscopy results showed that intermetallic compounds including Cu 6 Sn 5and Cu 3 Sn existed at bonding interface, which indicated that signifi cant atomic diff usion had occurred between Cu-Co-Pmicro-cones and Sn based solder. Probable mechanisms for low-temperature insertion bonding were discussed.
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Chen, Lin,Li, Ruimei,Chen, Feiyan,Zhang, Hantao,Zhu, Zhu,Xu, Shuyi,Cheng, Yao,Zhao, Yunan The Korean Society of Ginseng 2022 Journal of Ginseng Research Vol.46 No.5
Background: Ginsenosides and their metabolites have antidepressant-like effects, but the underlying mechanisms remain unclear. We previously identified 14-3-3 ζ as one of the target proteins of 20 (S)-protopanaxadiol (PPD), a fully deglycosylated ginsenoside metabolite. Methods: Corticosterone (CORT) was administered repeatedly to induce the depression model, and PPD was given concurrently. The tail suspension test (TST) and the forced swimming test (FST) were used for behavioral evaluation. All mice were sacrificed. Golgi-cox staining, GSK 3β activity assay, and Western blot analysis were performed. In vitro, the kinetic binding analysis with the Biolayer Interferometry (BLI) was used to determine the molecular interactions. Results: TST and FST both revealed that PPD reversed CORT-induced behavioral deficits. PPD also ameliorated the CORT-induced expression alterations of hippocampal Ser9 phosphorylated glycogen synthase kinase 3β (p-Ser9 GSK 3β), Ser133 phosphorylated cAMP response element-binding protein (p-Ser133 CREB), and brain-derived neurotrophic factor (BDNF). Moreover, PPD attenuated the CORT-induced increase in GSK 3β activity and decrease in dendritic spine density in the hippocampus. In vitro, 14-3-3 ζ protein specifically bound to p-Ser9 GSK 3β polypeptide. PPD promoted the binding and subsequently decreased GSK 3β activity. Conclusion: These findings demonstrated the antidepressant-like effects of PPD on the CORT-induced mouse depression model and indicated a possible target-based mechanism. The combination of PPD with the 14-3-3 ζ protein may promote the binding of 14-3-3 ζ to p-GSK 3β (Ser9) and enhance the inhibition of Ser9 phosphorylation on GSK 3β kinase activity, thereby activating the plasticity-related CREBeBDNF signaling pathway.
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