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고집적 소자용 구리기둥범프 패키징에서 산화문제를 해결하기 위한 방법에 대한 연구
정원철,홍상진,소대화,황재룡,조일환,Jung, One-Chul,Hong, Sang-Jeen,Soh, Dae-Wha,Hwang, Jae-Ryong,Cho, Il-Hwan 한국전기전자재료학회 2010 전기전자재료학회논문지 Vol.23 No.12
Copper pillar tin bump (CPTB) was developed for high density chip interconnect technology. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM -1250 dry film photoresist (DFR), copper electroplating method and Sn electro-less plating method. Mechanical shear strength measurements were introduced to characterize the bonding process as a function of thermo-compression. Shear strength has maximum value with $330^{\circ}C$ and 500 N thenno-compression process. Through the simulation work, it was proved that when the copper pillar tin bump decreased in its size, it was largely affected by the copper oxidation.
김태범(Tae-bum Kim),정태희(Tae-hee Jung),신준오(Jun-o Shin),강기환(Ki-hwan Kang),안형근(Hyeung-kun Ahn),황재룡(Jae-ryong Hwan),한득영(Deuk-young Ha) 한국태양에너지학회 2010 한국태양에너지학회 학술대회논문집 Vol.2010 No.4
In this paper, according to the position of the ribbon and the electrode contact resistance due to increased solar output characteristics were tested to see if this changes. Corrosion and partial detachment of ribbons made of solar modules produced by the same process conditions, the results can be compared. But for more accurate data, the relation between the electrode and a ribbon in addition to other possible errors should be excluded. Contact resistance increases as the state assumes the extreme condition of abruption, and solar cell detachment and three-part test and the results were analyzed by separating
a-Si 박막태양전지의 Shading 면적과 위치에 따른 출력 특성 변화
신준오(Shin Jun-Oh),정태희(Jung Tae-hee),김태범(Kim Tae-Bum),강기환(Kang Gi-Hwan),안형근(Ahn Hyung-Keun),황재룡(Hwang Jae-Ryong),한득영(Han Deuk-Young) 한국태양에너지학회 2010 한국태양에너지학회 학술대회논문집 Vol.2010 No.4
It is known that shading acts on Power Drop of a-Si:H thin film photovoltaic module. However, the uniformity of thin film PV module is important better than anything. Because non-uniform functions as a shading. In this paper, it is verified that deposited layer's uniformity affects on resistance locally through shading experiment method. Sectional non-uniform resistance changes resistivity of solar cell and electric field. Actually a-Si:H thin film PV module manufacturing process' characteristic affects on uniformity. But we don't have to ignore uniformity, because solar cell is influenced by resistance. From this point of view the deposition rate uniformity will be discussed.