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민성기 ( Sung Ki Min ),김경태 ( Kyung Tae Kim ),황운석 ( Woon Suk Hwang ) 한국부식방식학회(구 한국부식학회) 2011 Corrosion Science and Technology Vol.10 No.4
This study was performed to improve the corrosion resistance and the stability of passive film on copper tube by potentiostatic polarization method in synthetic tap water. Formation of passive film was carried out by anodic potentiostatic polarization at various passivation potentials and passivation times in 0.1 M NaOH solution. Stability of passive film and corrosion resistance was evaluated by self-activation time, τ0 from passive state to active state on open-circuit state in 0.1 M NaOH solution. Addition of polyphosphate in NaOH solution prolonged the self-activation time and improved the corrosion resistance, and the addition of 5 ppm polyphosphate was most effective. It was also observed that better corrosion resistance was obtained by potentiostatic polarization at 1.0 V (vs. SCE) than at any other passivation potentials. Passivated copper tube showed perfect corrosion resistance for the immersion test in synthetic tap water showing that the anodic potentiostatic polarization treatment in 0.1 M NaOH with 5 ppm polyphosphate solution would be effective in improving the corrosion resistance and preventing the blue water problem.
강수영(Soo Young Kang),이정자(Jeong Ja Lee),양승기(Seung gi Yang),황운석(Woon suk Hwang) 한국표면공학회 2015 한국표면공학회지 Vol.48 No.2
Nickel is a commercially important and versatile element in electroplating. The applications of nickel electroplating fall into three main categories: decorative, functional and electroforming. In decorative applications, electroplated nickel is most often applied in combination with electrodeposited chromium. Nickel is deposited on surfaces to improve corrosion and wear resistance or modify magnetic and other properties. Electroforming is electroplating applied to the fabrication of products of various kinds. Nickel is deposited onto a substrate and then removed from it to create a part made entirely of nickel. In this study, mechanical property of Ni electrodeposits in various manufacturing condition such as temperature, current density, pH and electrolyte content, was investigated to understand effect of electrolysis condition on mechanical property. Vickers hardness increased as the temperature and pH increased and current density and electrolyte content decreased and pH increased. The results were explained by cathode overvoltage and hydrogen evolution.
황산구리 전착에서의 첨가제가 구리전착층의 경도에 미치는 영향
민성기 ( Sung Ki Min ),이정자 ( Jeong Ja Lee ),황운석 ( Woon Suk Hwang ) 한국부식방식학회(구 한국부식학회) 2011 Corrosion Science and Technology Vol.10 No.4
Copper electroplating has been applied to various fields such as decorative plating and through-hole plating. Technical realization of high strength copper preplating for wear-resistant tools and molds in addition to these applications is the aim of this work. Brighters and levelers, such as MPSA, Gelatin, Thiourea, PEG and JGB, were added in copper sulfate electrolyte, and the effects of these organic additives on the hardness were evaluated. All additives in this work were effective in increasing the hardness of copper electrodeposits. Thiourea increased the hardness up to 350 VHN, and was the most effective accelarator in sulfate electrolyte. It was shown from the X-ray diffraction analysis that preferred orientation changed from (200) to (111) with increasing concentration of organic additives. Crystallite size decreased with increasing concentration of additive. Hardness was increased with decreasing crystallite size, and this result is consistent with Hall-Petch relationship, and it was apparent that the hardening of copper electrodeposits results from the grain refining effect.
착화제와 pH가 무전해 Ni-Co-P 도금 피막의 석출거동에 미치는 영향
최벽근 ( Byuck Keun Choi ),양승기 ( Seung Gi Yang ),신지웅 ( Ji Wung Shin ),황운석 ( Woon Suk Hwang ) 한국부식방식학회(구 한국부식학회) 2014 Corrosion Science and Technology Vol.13 No.3
Electroless plated Ni-Co-P films have been used to suppress the electromagnetic waves from magnetic recording media, and the suppression is known to be achieved with films made with optimized plating composition and plating condition. Effects of complexing agents on the deposition rate and bath stability of Ni-Co-P film were studied using sodium citrate, sodium tartrate and multi-complex agents containing both of them. Deposition of electroless Ni-Co-P platings was dependent upon the complexing agents. Deposition rate was twice when using sodium tartrate compared to that using sodium citrate. And it was slightly slower with multi-complex agents than with sodium tartrate, bath stability being declined in the former. Deposition rate increased with increasing pH until pH 11. Excellent bath stability and good deposition rate were obtained using multi-complex agent as sodium citrate 0.10 mol/L and sodium tartrate 0.15 mol/L in the electroless Ni-Co-P plating films.