http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
- 中文 을 입력하시려면 zhongwen을 입력하시고 space를누르시면됩니다.
- 北京 을 입력하시려면 beijing을 입력하시고 space를 누르시면 됩니다.
RISS 인기검색어
- 검색키워드
- 저자 : 한덕곤(Deok-Gon Han) (검색결과 3 건)
- 무료
- 기관 내 무료
- 유료
-
미세피치 패키지 적용을 위한 thin ENEPIG 도금층의 솔더링 특성
백종훈,이병석,유세훈,한덕곤,정승부,윤정원,Back, Jong-Hoon,Lee, Byung-Suk,Yoo, Sehoon,Han, Deok-Gon,Jung, Seung-Boo,Yoon, Jeong-Won 한국마이크로전자및패키징학회 2017 마이크로전자 및 패키징학회지 Vol.24 No.1
본 연구에서는 미세피치 패키지 적용을 위한 기초 실험으로 thin ENEPIG(Electroless Nickel Electroless Palladium Immersion Gold) 도금층을 형성하여 솔더링 특성을 평가하였다. 먼저, Sn-3.0Ag-0.5Cu (SAC305) 솔더합금에 대한 thin ENEPIG 도금층의 젖음 특성이 평가되었으며, 순차적인 솔더와의 반응에 대한 계면반응 및 솔더볼 접합 후 고속 전단 시험을 통한 접합부 기계적 신뢰성이 평가되었다. 젖음성 시험에서 침지 시간이 증가함에 따라 최대 젖음력은 증가하였으며, 5초의 침지 시간 이후에는 최대 젖음력이 일정하게 유지되었다. 초기 계면 반응 동안에는 $(Cu,Ni)_6Sn_5$ 금속간화합물과 P-rich Ni 층이 SAC305/ENEPIG 계면에서 관찰되었다. 연장된 계면반응 후에는 P-rich Ni 층이 파괴 되었으며, 파괴된 P-rich Ni 층 아래에는 $(Cu,Ni)_3Sn$ 금속간화합물이 생성되었다. 고속 전단 시험의 경우, 전단속도가 증가함에 따라 취성 파괴율이 증가하였다. In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.
-
Sn-3.0Ag-0.5Cu 솔더 접합부의 계면반응과 취성파괴율에 미치는 Thin ENEPIG 도금두께의 영향
백종훈(Jong-Hoon Back),유세훈(Sehoon Yoo),한덕곤(Deok-Gon Han),정승부(Seung-Boo Jung),윤정원(Jeong-Won Yoon) 대한용접·접합학회 2018 대한용접·접합학회지 Vol.36 No.5
In this paper, we evaluated the interfacial reactions and brittle fracture behaviors of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layers with different Ni and Pd thicknesses for fine-pitch package applications. Firstly, the interfacial reactions and mechanical reliability of Sn-3.0Ag-0.5Cu (SAC305)/thin ENEPIG solder joints were evaluated. (Cu,Ni)6Sn5 intermetallic compound (IMC) was formed at all of the thin ENEPIG interfaces, and P-rich Ni layer was also observed at the joint interface of the Pd substrate with 0.3 ㎛ Ni thickness. The interfacial IMC thickness decreased with increasing Ni and Pd thicknesses. In addition, the IMC thickness was affected by the contents of the Pd plating layer. The IMC thickness for the Pd-P substrate was thicker than that for the Pd substrate. In the high-speed shear test, the brittle fracture rate decreased with increasing Ni and Pd thickness. Also, the brittle fracture rate was affected by the components of the Pd plating layer, and the brittle fracture rate for the Pd substrate was lower than that for the Pd-P substrate. The ENEPIG joint with thicker Ni plating layer had superior interfacial stability and mechanical reliability.
-
0.1 ㎛ Ni두께를 가지는 얇은 ENEPIG 층과 Sn-3.0Ag-0.5Cu 솔더와의 계면반응 및 접합강도
백종훈(Jong-Hoon Back),유세훈(Sehoon Yoo),한덕곤(Deok-Gon Han),정승부(Seung-Boo Jung),윤정원(Jeong-Won Yoon) 대한용접·접합학회 2017 대한용접·접합학회지 Vol.35 No.6
A new multilayer metallization, ENEPIG (electroless nickel electroless palladium immersion gold) with 0.1㎛ thin Ni(P) layer (thin-ENEPIG), was plated on a Cu PCB substrate for fine-pitch package applications. We evaluated interfacial reactions and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate during various reflow times. In the initial soldering reaction, (Au,Cu)Sn₄ intermetallic compound (IMC) formed at the SAC305/ENEPIG interface. After prolonged reflow reactions, the Pd and Ni layers were consumed, and (Cu,Ni)6Sn5 IMC formed on the Cu layer. As the reflow time increased, the Cu and Ni contents in (Cu,Ni)6Sn5 IMC increased and decreased, respectively, due to the limited Ni layer in the ENEPIG plating layer. In the low-speed shear test, all fractures occurred in the bulk solder regardless of reflow times. In the high-speed shear test, the fracture mode was changed from ductile to brittle with increasing reflow time, due to the formation of the thick interfacial IMC.
ScienceON
스콜라연관 검색어 추천
이 검색어로 많이 본 자료
활용도 높은 자료
