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방진영,하상백,이종찬,Bang, Jin-Young,Ha, Sang-Baek,Lee, Jong-Chan 한국기계가공학회 2004 한국기계가공학회지 Vol.3 No.1
In this paper, the relationship between the mechanical properties of alumina abrasives and grinding performance was investigated. Micro vickers hardness and fracture strength of all abrasives used in this study were measured. The grinding experiments were earned out with alumina grinding wheels made by various kinds of alumina abrasives including 32A, WA, ART, ALOMAX, and RA. The performance of such grinding wheel for grinding SKD11 was evaluated by specific grinding energy, grinding-ratio, and surface roughness. The grinding wheels composed by the harder abrasives and the lower fracture strength abrasives showed better grinding performance.
최영휴(Young-Hyu Choi),김인수(In-Su Kim),최성주(Seong-Ju Choi),하상백(Sang-Baek Ha),안대균(Dae-Kyun Ahn) 대한기계학회 2006 대한기계학회 춘추학술대회 Vol.2006 No.6
In this paper, an optimum design method based on G.A. with variable penalty was applied to the structural design optimization of a wafer grinding machine for minimum weight and maximum stiffness. The contradictive objectives were converted into a single objective function by using weighting method and introducing compliance instead of stiffness. The design optimization conducts static- and dynamic-optimizations successively. In the dynamic optimization, the solution having best fitness is selected among GDS(Good Design Solution set), which is the set of solutions having relatively higher fitness. GDS is obtained from static design optimization process. after design optimization, the dynamic compliance of the machine structure was reduced by 14.6% with a little increase of weight by 2.3% than before. The measured compliance of the optimum designed wafer grinding machine showed good agreement with the theoretical optimization result.
김동석(Dong-seok Kim),최춘규(Chun-kyu Choi),하상백(Sang-baek Ha),이상직(Sang-jik Lee) 대한기계학회 2004 대한기계학회 춘추학술대회 Vol.2004 No.4
In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of wafer. The grinding of wafer is usually used by the infeed grinding machine. The infeed grinding machine has been depended on imports. Therefore, it is necessary to develop the infeed grinding machine because the demand of the infeed grinding machine is increasing more and more. This paper describes the technologies of infeed grinding machine and intend to introduce the studies in the development of the intelligent grinding system for grinding of wafer. The air bearing spindle for the infeed grinding machine was developed by domestic technologies and the grinding part design of the intelligent grinding system for wafer grinding was completed.