http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
차강일(Gang il Cha),송성민(Seong min Song),조한서(Han seo Cho),전승호(Seung ho Jeon),김명규(Myung kyu Kim),유상석(Sang seok Yu) 대한기계학회 2013 대한기계학회 춘추학술대회 Vol.2013 No.12
In PCB(printed circuit board) electrical test, failure phenomena are occurred such as pin slip and pad delamination. This phenomena result in damage of PCB and decrease of yield rate. Property analysis of pin-pad contact is needed to improve arrangement and degree of precision. In this study, high speed digital camera is used to capture the instance of pin contact on the pad. The lab scale jig is applied to the experiment of the observation. And to control of pin-pad movement, the three dimension moving system is developed using manual and motorized stages. The lens system is consist of 10x objective and 12x zoom lens to changing FOV(field of view). And the light system is composed 1㎾ halogen lamp and concave mirrors, to enhance light source. Using the system, the 70㎛ pin and 20㎛ pad contact scenes are acquired. And pin slip phenomenon is shown in pin-pad contact scenes.
120kW급 IGBT 인버터의 열 응답 특성 실시간 모델
임석연,차강일,유상석 한국수소및신에너지학회 2015 한국수소 및 신에너지학회논문집 Vol.26 No.2
As the power electronics system increases the frequency, the power loss and thermal management are paid more attention. This research presents a real time model of dissipation power with junction temperature response for 120kw IGBT inverter which is applied to the thermal management of high power IGBT inverter. Since the computational time is critical for real time simulation, look-up tables of IGBT module characteristic curve are implemented. The power loss from IGBT provides a clue to calculate the temperature of each module of IGBT. In this study, temperature of each layer in IGBT is predicted by lumped capacitance analysis of layers with convective heat transfer. The power loss and temperature of layers in IGBT is then communicated due to mutual dependence. In the dynamic model, PWM pulses are employed to calculation real time IGBT and diode power loss. Under Matlab/Simulink® environment, the dynamic model is validated with experiment. Results showed that the dynamic response of power loss is closely coupled with effective thermal management. The convective heat transfer is enough to achieve proper thermal management under guideline temperature
인쇄회로 기판의 전기검사에서의 미세 탐침과 패드의 동적 거동 현상 관측
송성민(Seongmin Song),차강일(Gangil Cha),김명규(Myungkyu Kim),전승호(Seungho Jeon),유상석(SangSeok Yu) 대한기계학회 2015 大韓機械學會論文集B Vol.39 No.3
인쇄기판의 양산 신뢰성 확인을 위한 전기검사에서는 다수의 미세 탐침들이 기판의 패드와 접점을 유지하며 회로의 전기적 신뢰성을 확인하는 검사이다. 이 때 다수의 탐침들이 모두 정 정렬 될 수 없으므로 탐침의 충돌하는 위치와 각도는 기판에 심각한 결과를 초래할 수 있다. 본 연구에서는 탐침이 패드와 충돌하는 상황에서 발생할 수 있는 탐침의 미끄러짐 현상을 관측하고자 한다. 탐침은 접촉부가 둥근형상과 평평한 형상의 두 종류를 선정하였고, 탐침 돌출 길이, 탐침 직경, 이송 속도 등이 탐침의 미끄러짐에 주는 영향을 관찰하였다. 이를 통해 전기 검사 시 탐침의 경사에 따라 기판의 패드에 작용하는 수평 인가력과 탐침 경사각 사이의 관계를 조사하였으며, 또 전기 검사 후 미끄러진 탐침의 복원시 발생할 수 있는 탐침과 패드 사이의 역학관계에 대해서도 고찰하였다. 경사각은 탐침의 접촉부가 평평하면서 돌출길이가 짧고, 직경이 크며, 검사 속도가 느린 경우에 작다는 것을 확인하였다. In an electrical reliability test of a printed circuit board (PCB), the impact of the micro probing pins on the PCB needs to be checked to ascertain the quality of the circuit. In this study, the impact of the dynamic movement of the probing pin on the pad was observed. As a misaligned pin can exert horizontal force on the pad of the PCB, this study focused on the behavior of a misaligned probing pin. The parameters of observation were the circular and flat edges of the probing pin. The effects of the speed of movement, diameter, and the length of projection of the probing pin were also investigated. The results demonstrated that slippage angle is strongly affected by the shape of the edge of the probing pin, and that projection length is an important factor affecting pin slippage. In contrast, the speed of movement of the probing pin was able to double the slippage angle.