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차강일(Gang il Cha),송성민(Seong min Song),조한서(Han seo Cho),전승호(Seung ho Jeon),김명규(Myung kyu Kim),유상석(Sang seok Yu) 대한기계학회 2013 대한기계학회 춘추학술대회 Vol.2013 No.12
In PCB(printed circuit board) electrical test, failure phenomena are occurred such as pin slip and pad delamination. This phenomena result in damage of PCB and decrease of yield rate. Property analysis of pin-pad contact is needed to improve arrangement and degree of precision. In this study, high speed digital camera is used to capture the instance of pin contact on the pad. The lab scale jig is applied to the experiment of the observation. And to control of pin-pad movement, the three dimension moving system is developed using manual and motorized stages. The lens system is consist of 10x objective and 12x zoom lens to changing FOV(field of view). And the light system is composed 1㎾ halogen lamp and concave mirrors, to enhance light source. Using the system, the 70㎛ pin and 20㎛ pad contact scenes are acquired. And pin slip phenomenon is shown in pin-pad contact scenes.