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      • KCI등재후보

        연료전지용 공기공급기의 케이스 변형량 해석 및 개선설계

        제우성 한국기계기술학회 2011 한국기계기술학회지 Vol.13 No.4

        The air blowers for fuel cell electric vehicle usually have big difference between inlet and outlet pressure. When the casing of the air blowers is designed, the stress analysis is required. (Approximately Inlet pressure is 0.5bar and outlet pressure is 2bar.) Gap distance between the casing and the impeller is 0.3mm. Therefore, if the amount of maximum deformation of casing is larger than 0.3mm, impeller crashed the casing. In order to avoid crashing, both the thickness and number of rims are changed and carried out simulations on each cases.

      • KCI등재

        생체의학에 적용 가능한 테이퍼형태의 금속성 마이코로니들 어레이의 개발

        제우성,이정봉,김갑석,김경환,진병욱,Che Woo Seong,Lee Jeong-Bong,Kim Kabseog,Kim Kyunghwan,Jin Byung-Uk 한국마이크로전자및패키징학회 2004 마이크로전자 및 패키징학회지 Vol.11 No.2

        본 연구에서는 유리기판을 통한 SU-8의 이중층을 후면 노광을 통하여 테이퍼지고 속이 빈 형태의 마이크로니들 배열구조물을 만드는 새로운 방법을 제안하였으며 테이퍼지고 속이 빈 형태의 원형축의 Buckling현상에 관한 해석해를 구하였다. Pyrex 7740을 유리기판으로 사용하고 이중층 구조의 SU-8 막을 후면 노광으로 금형 구조물을 제작하는 공정을 개발하였다. $200\;{\mu}m$ 높이의 SU-8기둥들에서 $4.37{\sim}5^{\circ}$범위의 테이퍼 각도를 $400\;{\mu}m$ 높이의 SU-8기둥에서는 $3.08{\sim}4.48^{\circ}$범위 내의 테이퍼 각을 보여주고 있다. 후면 유체저장소와 가로세로 각각 10개의 테이퍼 형태로 전기도금된 니켈 마이크로니들 어레이를 유리 기판을 통해 이중층 구조의 SU-8막을 후면 노광하고. 니켈을 전기도금 함으로서 실현시켰다. $200\;{\mu}m$와 $400\;{\mu}m$ 높이의 벽두께 $10{\mu}m-20{\mu}m$ 및 내경 $33.6{\mu}m-101{\mu}m$인 마이크로니들 어레이를 제작하였다. 또한 $400\;{\mu}m$ 높이의 벽두께 $20\;{\mu}m$ 및 내경 $33.6\;{\mu}m$인 $3.08^{\circ}$의 테이퍼 각 마이크로니들의 임계 버클링힘은 1.8N이었다. 이 해는 차후의 테이퍼 형태의 마이크로니들의 설계시 많은 도움을 주리라 생각한다. This paper presents a novel fabrication process for a tapered hollow metallic microneedle array using backside exposure of SU-8, and analytic solutions of critical buckling of a tapered hollow microneedle. An SU-8 meta was formed on a Pyrex glass substrate and another SU-8 layer, which was spun on top of the SU-8 mesa, was exposed through the backside of the glass substrate. An array of SU-8 tapered pillar structures. with angles in the range of $3.1^{\circ}{\sim}5^{\circ}$ was formed on top of the SU-8 mesa. Conformal electrodeposition of metal was carried out followed by a mechanical polishing using a pianarizing polymeric layer. All organic layers were then removed to create a metallic hollow microneedle array with a fluidic reservoir on the backside. Both $200{\mu}m\;and\;400{\mu}m$ tall, 10 by 10 arrays of metallic microneedles with inner diameters of the tip in the range of $33.6{\sim}101\;{\mu}m$ and wall thickness of $10{\mu}m\;-\;20{\mu}m$ were fabricated. Analytic solutions of the critical buckling of arbitrary-angled truncated cone-shaped columns are also presented. It was found that a single $400{\mu}m$ tall hollow cylindrical microneedle made of electroplated nickel with a wall thickness of $20{\mu}m$, a tapered angle of $3.08^{\circ}$ and a tip inner diameter of $33.6{\mu}m$ has a critical buckling force of 1.8 N. This analytic solution can be used for square or rectangular cross-sectioned column structures with proper modifications.

      • 관성항법 장치용 Inductance형 가속도계 설계에 관한 연구

        제우성,오준호 경북대학교 센서기술연구소 1998 센서技術學術大會論文集 Vol.9 No.1

        A precision accelerometer for inertial navigation applications is developed. The low sensitivity threshold and high thermal stability are considered as design parameters. In order to guarantee low sensitivity threshold while maintaining robustness against shock, the push-pull type long flexures are used in this paper. To improve thermal stability, this paper suggests electromagnets as a source of magnetic field and develops the silicon case together with the temperature compensator. The silicon pendulum assembly and the modified inductance type pick-up is also developed to reduce assembling procedure. After assembling the accelerometer, static tests are carried out. Static test show a sensitivity threshold of 4.6X10^(-5)g and a maximum measurement range of ± 24g.

      • 관성항법장치용 가속도계의 펜들럼 설계에 관한 연구

        제우성 동명정보대학교 1998 東明情報大學校論文集 Vol.1 No.-

        The silicon pendulum with a flexure hinge is designed and fabricated for the servo type accelerometer which is used in INS(Inertial Navigation System). For the INS application, it is essential to measure low-frequency acceleration with high accuracy. Therefore pendulum could be moved easily at small amount of input acceleration. For the purpose, the long type flexure is adapted. To prevent flexures from being buckled, the special arrangement of flexures is designed. And the paper also describes in detail the etching process for fabricating silicon pendulum assembly. The servo type accelerometer with above mentioned silicon pendulum assembly is developed and is carried out static test. The long flexure reduce its stiffness considerably so that a stiffness of 1.6139 N/m is acquired. Static test show a sensitivity threshold of 4.6×10 exp (-6) g and a maximum measurement range of ±24g. These test results shows that the accelerometer presented in this study can be adequately used in precision motion measurement application such as strapdown inertial navigation systems.

      • KCI등재

        유수분리기용 정전용량형 센서의 성능향상에 관한 연구

        제우성,김경우,권휴상,Che, Woo-Seong,Kim, Kyong-Woo,Kwon, Hyu-Sang 한국정보통신학회 2006 한국정보통신학회논문지 Vol.10 No.10

        해양환경 규제 MEPC의 규제 강화로 인하여 더욱 정밀하고, 신뢰성을 확보한 빌지분리 센서 시스템이 필요하다. 빌지 분류기를 설계 제작하기 위해서는 기름과 물을 구별하는 정밀한 유수분리 레벨센서가 필요하다. 이를 위하여 본 연구에서는 정전용량형 레벨센서의 특성 파악을 위해 3차원 시뮬레이션을 수행하여 특성을 파악하였으며, 이를 토대로 레벨센서의 설계시 주요한 설계인자를 추출하였다. 동작회로를 Digital 회로로 구성함으로써, 정전용량형 센서의 원천적인 기생커패시턴스 문제를 해결하였으며, 실험장치를 구성한 후 실험을 수행하였다. 실험 결과를 보면 노이즈에는 강인해졌음을 알 수 있었다. 그리고 추출한 정전용량형 레벨센서의 설계인자를 이용하여 정밀도를 향상시키기 위한 연구가 향후에 진행 될 필요성이 있다. Demand of enhanced bilge separation sensor system has been recently increased due to the severe regulation reinforcement of MEPC(Marine Environment Production Committee). Up to date bilge separation sensor has to be extremely accurate and highly reliable. To design and build such a bilge separator. a precise oily water separation level sensor that distinguishes oil from water is critical. Three dimensional simulations have been carried out to figure out the characteristics of capacitive level sensors, which grounds the finding of the parameters required to design the sensors. The parasitic capacitance problem which is inherent to capacitive level sensors has been taken care of. This paper concludes with the future research direction that can be pursued with the newly defined parameters of the capacitive level sensors.

      • KCI등재

        광조형 공정시 휨에 의한 변형을 개선하기 위한 역설계 시스템의 적용

        제우성,Che, Woo-Seong 한국반도체디스플레이기술학회 2009 반도체디스플레이기술학회지 Vol.8 No.4

        The slender device(long length and thin width) manufactured by stereolithography process suffers from large curl distortion. This paper adapts two control parameters such as a critical exposure and a penetration depth. The measurement of the test parts dimension are carried out by reverse engineering method with the optical 3-dimensional measurement equipment. We investigate how each parameter contributes to the part accuracy and estimates the optimal set of parameters which minimizes the dimensional error of the test parts. Finally, As being an the RAM slot as being an example of the slender device, the RAM slot is made with the optimal values of control parameter and the results are investigated

      • KCI등재

        Determination of Microwave Waveguide Position for Potato Chip Drying System with Multiple Waveguides

        제우성 한국기계기술학회 2014 한국기계기술학회지 Vol.16 No.1

        In this paper, numerical simulations are performed for the drying process of potato chip in a microwave oven with multiple waveguides, with the purpose of enhancing the uniformity in temperature distribution. A simulation model is built and simulated using COMSOL Multiphysics software. The simulation model uses 5 different positions of waveguides to see whether it affects the heat distribution in the material. In order to know the final temperature result of the material after it comes out of the cavity on a moving conveyor belt, the average temperature values along the direction of the conveyor belt motion are calculated and plotted. From the results, the best waveguide position is determined to get the best temperature distribution in the potato chips.

      • 실리콘 웨이퍼 직접 접합(SDB)에서 발생하는 Bubble의 모델 및 원인에 관한 연구

        제우성 동명정보대학교 1999 東明情報大學校論文集 Vol.2 No.-

        Silicon wafer direct bonding(SDB) technology allows silicon wafers to stick together without any adhesives and thus has been applied to various field, such as silicon on insulator(SOI) and MEMS applications. The success of SDB technology can be established by bonding on the bonded interface with no defects and preventing intrinsic bubbles in the temperature range of 200∼800℃. In this research, The bonded wafer is achieved in the SiO_2-SiO_2 bonding, which generates no intrinsic bubbles in the annealing under the atmospheric pressure. And, we observe the behavior of the intrinsic bubbles by transmitting the infrared light and the increase of the bubble pressure is found. The intrinsic bubbles are generated in the annealing at around 200℃ in the ultra high vacuum. The experimental result proves the relation between the bubble nucleation and the pressure in the thermodynamic model. It will provide the basis for the annealing process at the low temperature and the control of the intrinsic bubbles in the direct bonding of silicon wafers.

      • 헐셀을 이용한 전기접점의 위치에 따른 도금 두께의 영향에 관한 연구

        제우성,이동수,신재진 한국표면공학회 2010 한국표면공학회 학술발표회 초록집 Vol.2010 No.5

        Electroplating on acrylonitrile butadiene styrene (ABS) copolymer is used in many Industries. The coating thickness distribution is very important, not only for appearance but also for corrosion resistance. When electroplating some metalson ABS, electro-less nickel plating is performed first. After this process, the thickness of the electro-less nickel is less than 0.5㎛ so that the electrical surface resistance is quite high. When the electroplating process is started, the position of the electrical contact affects the uniformity of the plated thickness across the surface of the object. We therefore investigated the relationship between the position of the electrical contact and the platedthickness distribution on the surface using a Hull Cell. Both experimental tests and numerical simulations were performed.

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