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디지탈 영상처리 기법을 이용한 인쇄회로기판의 자동시각검사
박규태,정진섭,강현철,이헌주 연세대학교 산업기술연구소 1987 논문집 Vol.19 No.2
This paper describes the automatic visual inspection of a loaded printed circuit board(PCB) using digital image processing and pattern classification. At first, the top view of the PCB is used to investigate the missing components and the bottom view to analyze the classes of solder pads. We extract four basic and four derived features such as normalized volume of local maximum block, unsymmetricity etc., and the two-stage-classifier is implemented to classify the solder pads into four classes. In experiments for the bottom side, classification algorithm is applied to 150 design samples and 300 test samples. The classification rate is more than 96% on 300 test pad images.