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Sn-3Ag-0.5Cu계 솔더를 이용한 자동차 전장 부품 접합부의 열충격 특성에 관한 연구
전유재,손선익,김도석,신영의,Jeon, Yu-Jae,Son, Sun-Ik,Kim, Do-Seok,Shin, Young-Eui 한국전기전자재료학회 2010 전기전자재료학회논문지 Vol.23 No.8
This study investigated the characteristics of fracture behavior and mode on solder joints before and after thermal shock test for automotive application component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as lead-free solder. The shear strength was decreased with thermal cycle number, after 432 cycles of thermal shock test. In addition, fracture mode was verified to ductile, brittle fracture and base materials fracture such as different kind fractured mode using SEM and EDS. Before the thermal shock, the fractured mode was found to typical ductile fracture in solder layer. After thermal shock test, especially, Ag was found on fractured portion as roughest surface. Moreover, it occurred delamination between a PCB and a Cu land. Before thermal shock test, most of fractured mode in solder layer has dimples by ductile fracture. However, after thermal shock test, the fractured mode became a combination of ductile and brittle fracture, and it also could find that the fracture behavior varied including delamination between substrate and Cu land.
신뢰성 평가를 위한 자동차 전장 부품의 기계적 접합강도 특성 및 오차범위에 관한 연구
전유재,김도석,신영의,Jeon, Yu-Jae,Kim, Do-Seok,Shin, Young-Eui 한국전기전자재료학회 2011 전기전자재료학회논문지 Vol.24 No.12
In this study, the characteristics and error ranges of the mechanical bonding strength were analyzed according to before and after thermal shock test for various chips of automotive application component using Sn-3.0Ag-0.5Cu solder. In the after thermal shock test, the mechanical bonding strengths tend to decrease, meanwhile decreasing rates of mechanical strengths were less then 12% at specimen's bonding area below 3.5$mm^2$, and were from 17 to 21% at specimen's bonding area above 12 $mm^2$. On the other hand, Specimen's mean deviation rates were about 5% at specimen's bonding area more than 12 $mm^2$. Inversely, at specimen's bonding area is less then 3.5 $mm^2$, mean deviation rates were increased to about 8%. It means that the smaller device size is, the larger mean deviation rate. In addition, error ranges and deviation rates of the mechanical bonding strengths may differ slightly depending on their bonding area. Furthermore, process conditions as well as method of mechanical reliability evaluation should be established to reduce the error ranges of bonding strength.
의료전자기기 적용을 위한 Epoxy 솔더 접합부의 신뢰성 평가
전유재(Yu-Jae Jeon),강민수(Min-Soo Kang) 한국생산제조학회 2021 한국생산제조학회지 Vol.30 No.2
In this study, the bonding characteristics of epoxy solder joints for the manufacture of highly reliable medical electronic devices were investigated. A total of 2000 cycles of thermal shock tests were performed by simulating the heat generation of electronic devices on specimens manufactured using eutectic solders (SAC305 and Sn58Bi) and epoxy solders (SACE and Sn58BiE). After the thermal shock, the formation of internal cracking owing to the difference in the thermal expansion coefficients of dissimilar material solder joints and the deterioration of the bonding properties of the solder joints was analyzed. Consequently, in the case of the epoxy solder, the epoxy was cured outside the solder joint, suppressing thermal stress owing to a difference in thermal expansion coefficients and suppressing the internal cracking of the solder joint, thereby improving the bonding characteristics of the solder joint.
지르코늄 실리케이트를 응집보조제로 이용한 응집공정에 관한 연구
조재성(Jae Seung Cho),윤태일(Tai Il Yoon),전유재(Yu Jae Jeon),조경철(Kyung Chul Cho) 大韓環境工學會 2009 대한환경공학회지 Vol.31 No.3
최근 산업화에 따른 다양한 신종 미량유해물질의 등장과 지속적인 오염물질의 증가로 수질오염의 심각성과 그 위해성에 대한 관심이 커지고 있다. 특히 응집공정을 통하여 유기오염물질 제거를 좀 더 효율적으로 증가시킬 수 있는 방법들이 모색되고 있다. 본 연구는 도시하수 및 호소수를 대상으로 실험하였다. 응집공정에 사용하기 위해 응집 보조제로서 사용될 수 있는 지르코늄 실리케이트(ZrSiO₄)의 특성을 연구 하였다. 응집공정에서의 지르코늄 실리케이트의 주입방법에 따른 유기물 제거율을 PDA (Photometric Dispersion Analyzer)를 통하여 평가하였다. 지르코늄 실리케이트는 pH 7에서 zeta-potential이 -32.22 mv였고 산성에 가까울수록 낮은 음(-)전하 값을 보였으며 지르코늄 실리케이트를 주입하지 않은 도시하수보다 주입하였을 때 UV₂54 값이 더 높은 특성을 나타내었다. 또한 PDA실험을 통하여 확인한 결과 지르코늄 실리케이트의 주입은 floc의 성장을 도와주는 것을 확인할 수 있었다. Alum을 이용한 응집공정에 대한 지르코늄 실리케이트의 주입방법을 선 주입, 동시 주입, 후 주입의 3가지 방법으로 실험을 수행하였다. 실험 결과 Alum과 지르코늄 실리케이트를 함께 주입한 경우 Alum을 단독으로 주입한 경우보다 유기물 제거율이 15% 이상 증가하였다. 특히 Alum 20 mg/L과 지르코늄 실리케이트 10 mg/L를 함께 사용한 경우 90% 이상의 높은 유기물제거율을 보였다. PAC (Poly Aluminium Chloride)와 PACS (Poly Aluminium Chloride Silicate)를 응집제로 이용하는 경우에도 지르코늄 실리케이트를 함께 주입 시 COD(Cr)의 제거효율이 15% 이상 향상되었다. 결과적으로 지르코늄 실리케이트를 응집제와 동시에 주입한 방법이 전, 후로 주입한 경우보다 COD(Cr) 제거효율이 5~10% 높게 나타났으나, 용존성 물질은 동시주입 시, 더 낮은 제거효율을 보였다. The concern of seriousness and harmful effects of environmental pollution is rising by the various water pollutions, appearances of new micro-noxious substances and increase of sustainable pollutants. The method is suggested that can effectively increase the removal of organic substances and several pollutants using a coagulation process. The experiment for characteristics of ZrSiO₄ (zirconium silicate) as a coagulation-aid was carried out for application to coagulation process with domestic wastewater and lake water, and the removal rate of the organic substances depending on a dosage was evaluated by PDA (Photometric Dispersion Analyzer) in this study. Zeta-potential of zirconium silicate solution was -32.22 mv at pH 7 and the lower negative(-) charge was detected in the more acidic conditions. Absorbance on UV₂54 presented higher when zirconium silicate was added than in a domestic wastewater itself. Besides, the results by PDA experiment represented that injection of zirconium silicate could promote growing of floc. Tests for coagulation process were conducted by three ways which are pre-injection, co-injection and post-injection of zirconium silicate with alum. Accordingly, removal efficiency of organic substances increased over 15% in co-injection than in using of alum as a sole reagent. When a 20 mg/L of alum was used with a 10 mg/L of zirconium silicate, the removal efficiency was high up to 90%. Removal efficiency of COD(Cr) was improved more than 15% in case of dosage of coagulant either PAC (Poly aluminium chloride) or PACS (Poly aluminium chloride Silicate) together with zirconium silicate. As a result, the removal efficiency of COD(Cr) were 5~10% higher in a co-injection of zirconium silicate with a coagulant than a pre-injection and a post-injection but it of soluble substances was lower in a co-injection.
열충격 시험을 통한 MLCCs SAC305 무연 솔더 접합부의 IMCs 성장과 접합특성 저하에 관한 연구
정상원,강민수,전유재,김도석,신영의,Jung, Sang-Won,Kang, Min-Soo,Jeon, Yu-Jae,Kim, Do-Seok,Shin, Young-Eui 한국전기전자재료학회 2016 전기전자재료학회논문지 Vol.29 No.3
The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.
강민수(Kang Min-Soo),전유재(Jeon Yu-Jae),손선익,김도석(Kim Do-Seok),신영의(Shin Young-Eui) 한국태양에너지학회 2012 한국태양에너지학회 학술대회논문집 Vol.2012 No.3
본 연구에서는 열충격 시험을 통하여 Cell레벨에서의 효율저하 특성을 분석하였다. 열충격 시험은 PV모듈의 시험 규격인 KS C IEC-61215를 이용하여 보다 가혹한 조건인 -40℃에서 120℃의 조건으로 500사이클 수행하였다. I-V 측정을 통하여 효율을 분석한 결과, 열충격 시험 전 13.9%에서 열충격 시험 후 11.0%로 효율이 저하 됐으며, 감소율은 20.9% 나타났다. EL촬영을 통해 표면을 분석한 결과 Ribbon접합부 및 Gridfinger의 손상으로 확인 됐으며, 보다 정확한 효율 저하의 원인을 분석하기 위해 단면분석을 실시한 결과 표면손상으로 확인 되었던 위치의 Cell내부에서도 Crack을 확인 할 수 있었다. 또한 FF값을 분석한 결과 열충격 시험 전 72.3%에서 시험 후 62.0%로 11.8%의 감소율을 보였다. 따라서, 경년 시 나타나는 효율저하는 Cell자체의 소모전력 증가와 외부환경에 의한 표면 손상 및 Cell내부의 Crack에 기인하여 가속된다고 판단된다.