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Fuse Element 제조에 Photoetching 응용
윤정한,이홍로 대한금속재료학회(대한금속학회) 1995 대한금속·재료학회지 Vol.33 No.1
For fuse element fabrication with glass-ceramic substrate, photoetching technic was applied. To control copper layer thickness on glass-ceramic substrate, continuous electroless plating rates were monitored using QCM method. Plating rates were 0.6∼l㎛/hr, which value increased with Rochelle Salts addition. At 0.1%HF, 2min etching condition, adhesion between glass-ceramic and copper layer was most favorable. Etching factor value was most favorable at 1.8kgf/min injection pressure and 2.5M/L of etchant concentration. Fuse element design of stepped layer was a little effective for arc duration and preventing fuse temperature from rising suddenly.