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Chip Scale Package 기술을 이용한 곡면형상의 광원 모듈에 대한 연구
이한명(Han Myung Lee),김진홍(Jin Hong Kim) 한국조명·전기설비학회 2017 조명·전기설비학회논문지 Vol.31 No.2
LED light source technology has improved every time it encounters its limitations. LED light source technology has improved every time it encounters its limitations. Among them, there is technology related with manufacturing costs, which is Chip scale package light source. This technology improves the package process by eliminating the lead frame. In this paper, this chip package technology was appliedy to the module. Silicon was used to enhance the physical protection characteristics of the applied modules. This protection technology was applied to a flexible pcb, and a flexible pcb was used to realize curvature formation. The measurement jig was fabricated to investigate the silicon failure characteristics after curvature formation, and the reliability of the curvature characteristics was verified using this jig. The conditions of the module for implementing the curvature formation should use silicon with sufficient hardness.
具然健,金斗根,李漢明 弘益大學校 1983 弘大論叢 Vol.15 No.2
A procedure for designing a band-pass filter of quarter-wavelength microstrip resonator with interdigital array is presented. After the design curve is determined experimentally by the resonance phenomena of several pairs of resonators, the microstrip interdigital filter for center frequency of 700 MHz and fractional bandwidth of 20% is designed. It is obtained that the fractional bandwidth is 19.43%, centered at 695 MHz. An experimental results show that the computed values almost agree with measured values except for the ripple which is negligible.