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이상일(S.I. Yi),신정규(J.K. Shin),박경진(G.J. Park) 한국정밀공학회 2005 한국정밀공학회 학술발표대회 논문집 Vol.2005 No.10월
Optimum sensitivity analysis (OSA) is the process to find the sensitivity of optimum solution with respect to the parameter in the optimization problem. The prevalent OSA methods calculate the optimum sensitivity as a post-processing. In this research, a simple technique is proposed to obtain optimum sensitivity as a result of the original optimization problem, provided that the optimum sensitivity of objective function is required. The parameters are considered as additional design variables in the original optimization problem. And then, it is endowed with equality constraints to penalize the additional variables. When the optimization problem is solved, the optimum sensitivity of objective function is simultaneously obtained as Lagrange multiplier. Several mathematical and engineering examples are solved to show the applicability and efficiency of the method compared to other OSA ones.
Ni25Mn75 - Spin Valve 박막 자유층의 열처리 순환수에 따른 자기저항 특성
이낭이(N. I. Lee),이주현(J. H. Yi),이가영(G. Y. Lee),김미양(M. Y. Kim),이장로(J. R. Rhee),이상석(S. S. Lee),황도근(D. G. Hwang) 한국자기학회 2000 韓國磁氣學會誌 Vol.10 No.2
Annealing cycle number and nonmagnetic layer thickness dependences of interlayer coupling field (Hinf) and coercivity (Hcf) of free magnetic layer on NiMn alloy-spin valve films (SVF) were investigated. The SVF is Glass (7059)/Ni_(81)Fe_(19)(70Å)/Co(10 Å)/Cu(t Å)/Co(15 Å)/Ni_(81)Fe_(19)(35 Å)/Ni_(25)Mn_(75)(250 Å)/Ta(50 Å) films, it were fabricated using the dc sputtering method at different pinning layer thickness and nonmagnetic spacer thickness (Cu thickness; 30 Å, 35 Å, 40 Å) of NiMn alloy with 25 at.%. Ni In case that Cu thickness of SVF is 35 Å and peak exchange coupling field (Hex) was 620 Oe, while coercivity Hc=280 Oe and MR ratio showed 2.5%. As for Hinf and Hcf, every SVF increased up to the stabilized values with the increase of annealing cycle number 15, which were Hinf of 120 Oe and Hcf of 75 Oe. The increase of Hcf with the annealing cycle number seems to be caused by the effective reduction of Cu layer thickness due to the increase of interfacial mixing of Cu layer and Co layer. In addition, the Hinf and Hcf dependences of free NiFe layer by the interfacial mixing effect were appeared the different aspects when Cu layer becomes more thinner and thicker than Cu layer thickness of 35 Å, respectively.