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3.5MCuCl₂+0.5MHCl+0.5MKCl 용액으로 식각된 구리표면의 결합상태에 대한 정량적 분석연구
강민구,김석,오경희,윤경렬 연세대학교 산업기술연구소 1995 논문집 Vol.27 No.2
Thermally evaporated copper was chemically etched with 3.5McuCl₂+0.5MHCl+0.5MKCl at room temperature. X-ray photoelectron was used to characterize the surface chemical bonding states. The result shows that the surface of chemically etched copper with 3.5McuCl₂+0.5MHCl+0.5MKCl solution is composed of carbon, oxygen, chlorine and copper. Through the quantitative comparison and bonding state analysis of the photoelectron spectra and Auger electron spectra for the surface elements, the qualitative and quantitative bonding states of Cu could be characterized as Cu-Cu, Cu-Cl, Cu-O, and Cu-2Cl bonds.