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전자패키지용 EMC의 기계적 성질 및 패키지내의 열응력해석
신동길,이정주,Shin, Dong-Kil,Lee, Jung-Ju 대한기계학회 1996 大韓機械學會論文集A Vol.20 No.11
In this study, as a part of basic study for developing the simulation program for the assemssment of reliability of electronic EMC packaging which covers from EMC mixing step to thermal analysis, comparison between a measured and predicted values of material properties of EMC and finitde element analysis of thermal stress are performed. For the experimental testing specimens of fifty, sixty hive and eighty percent filler($13\mu m$, spherical silica) weight fraction are fabricated using tranfer molding. Coefficient of thermal expansion, elastic modulus and thermla conductivity are measured using these specimens and then these measured values are compared with the predicted values by various equations ( such as dilute suspension method. self consistent method, generalized self consistent method, Hashin-Shtrikman's bounds. Shapery's bounds, Nielsen's method and others). Measured values are distributed within the upper and lower bounds of equations. Measured elastic modulus and coefficient of thermal expansion approaches closely the perdicted values with self consisten mehtod and upper bound of Shaperys equation respectively. However small differences of thermal conductivity between the different filler volume fraction are obserbed. FEM analysis indicates that firstly stress is concentrated at the corner section of EMC and secondly EMC with eighty percent filler weight fraction shows less thermal stress when package is cooling down and relatively high thermal stress when package is heating up.
Thermoelectric Properties of Ce<SUB>z</SUB>Co₄Sb<SUB>12</SUB> Skutterudites
Kwan-Ho Park(박관호),Dong-Kil Shin(신동길),Il-Ho Kim(김일호) 한국정보기술학회 2016 한국정보기술학회논문지 Vol.14 No.4
N-type Ce<SUB>z</SUB>Co₄Sb<SUB>12</SUB> were synthesized and filling effects of Ce on the transport and thermoelectric properties of skutterudites were examined. Ce<SUB>z</SUB>Co₄Sb<SUB>12</SUB> skutterudite phases were decomposed to Ce₂Sb and CoSb₂ when z ≥ 0.3, indicating that a filling fraction limit of Ce is lower than 0.3. The electrical conductivity increased with increasing Ce filling content. The power factor increased with increasing temperature, and then decreased after reaching maximum. The lattice thermal conductivity decreased with increasing Ce filling content, and Ce<SUB>z</SUB>Co₄Sb<SUB>12</SUB> showed low values of approximately 2.5∼4.8 W/mK at all temperatures examined. Ce<SUB>0.2</SUB>Co₄Sb<SUB>12</SUB> showed the highest ZT = 0.44 at 823K.