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Epitaxial-Growth-Induced Junction Welding of Silver Nanowire Network Electrodes
강형석,송솔지,김정구,조정호 한국공업화학회 2019 한국공업화학회 연구논문 초록집 Vol.2019 No.0
In this study, we developed a roll-to-roll Ag electroplating process for metallic nanowire electrodes using a Galvanostatic mode. Metallic nanowire networks [silver nanowires (AgNWs) and copper nanowires (CuNWs)] coated onto a polyethylene terephthalate (PET) film were immersed directly in an electroplating bath containing AgNO3. Silver ions (Ag+ ions) were deposited onto the nanowire surface through application of a constant current via an external circuit. The optimized Ag-electroplated AgNW (Ag-AgNW) films exhibited a sheet resistance of ~19 Ω/sq at an optical transmittance of 90% (550 nm). A transmission electron microscopy (TEM) study confirmed that Ag grew epitaxially on the AgNW surface but a polycrystalline Ag structure was formed on the CuNW surface. The Ag-electroplated metallic nanowire electrodes were successfully applied to various electronic devices such as organic light-emitting diodes, triboelectric nanogenerators, and a resistive touch panel.