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요소수지의 F/U 몰비별로 제조된 목질패널의 포름알데히드 장기 방출 경향
박헌,Park, Heon 한국가구학회 2000 한국가구학회지 Vol.11 No.2
This study was carried out to measure formaldehyde emission with the passing of two years from plywood, sliver-board and strand-board bonded with urea resins which were made of 6 f/U molar ratios. The urea resins were manufactured by six kinds of formaldehyde/urea molar ratio of 1.0, 1.2, 1.4, 1.6, 1.8 and 2.0. 1. The plywood with molar ratio of 1.0 satisfied the KS F3101 $F_2$ directly after manufacture. The plywood with molar ratio of 1.2 satisfied m 3 days. The plywood with molar ratio of 1.4 satisfied the $F_3$ in 3 days and the $F_2$ in 600 days. And the plywood with molar ratio of 1.8 and 2.0 satisfied the $F_3$ in 365 days, but didn't satisfy the $F_2$ in 730 days. 2. Sliver-board with molar ratio of 1.0 and 1.2 satisfied the KS F3104 $E_2$ right after manufacture. Sliver-board with molar ratio of 1.4 and 1.6 satisfied in 150 and 360 days, respectively. Sliver-board with molar ratio of 1.8 and 2.0 satisfied in 730 days. 3. Strand-board with molar ratio of 1.0 and 1.2 satisfied the KS F3104$ E_2$ directly after manufacture. Strand-board with molar ratio of 1.4 and 1.6 satisfied in 150 days. But Strand-board with molar ratio of 1.8 and 2.0 didn't satisfied in 730 days.
Power IC용 저면적 Differential Paired eFuse OTP 메모리 설계
박헌,이승훈,진교홍,하판봉,김영희,Park, Heon,Lee, Seung-Hoon,Jin, Kyo-Hong,Ha, Pan-Bong,Kim, Young-Hee 한국정보전자통신기술학회 2015 한국정보전자통신기술학회논문지 Vol.8 No.2
In this paper, a small-area 32-bit differential paired eFuse OTP memory for power ICs is designed. In case of smaller number of rows than that of columns for the OTP memory cell array, a scheme for the cell array reducing the number of SL driver circuits requiring their larger layout areas by routing the SL (source line) lines supplying programming currents for eFuse links in the row direction instead of the column direction as well as a core circuit is proposed. In addition, to solve a failure of being blown for non-blown eFuse links by the electro-migration phenomenon, a regulated voltage of V2V ($=2V{\pm}0.2V$) is used to a RWL (read word line) driver circuit and a BL (bit line) pull-up driver circuit. The layout size of the designed 32-bit eFuse OTP memory is $228.525{\mu}m{\times}105.435{\mu}m$, which is confirmed to be 20.7% smaller than that of the counterpart using the conventional cell array routing, namely $197.485{\mu}m{\times}153.715{\mu}m$. 본 논문에서는 Power IC용 저면적 32비트 differential paired eFuse OTP 메모리를 설계하였다. OTP 메모리 셀 어레이에서 행의 개수가 열의 개수보다 더 작은 경우 eFuse 링크의 프로그램 전류를 공급하는 SL (Source Line) 구동 라인을 열 방향으로 라우팅하는 대신 행 방향으로 라우팅하므로 레이아웃 면적을 많이 차지하는 SL 구동회로의 수를 줄이는 differential paired eFuse 셀 어레이 방식과 코어 회로를 제안하였다. 그리고 blowing되지 않은 eFuse 링크가 EM (Electro-Migration) 현상에 의해 blowing되는 불량을 해결하기 위해 RWL (Read Word-Line) 구동 회로와 BL (Bit-Line) 풀-업 부하회로에 V2V ($=2V{\pm}0.2V$)의 regulation된 전압을 사용하였다. 설계된 32비트 eFuse OTP 메모리의 레이아웃 면적은 $228.525{\mu}m{\times}105.435{\mu}m$으로 기존의 셀 어레이 라우팅을 이용한 IP 크기인 $197.485{\mu}m{\times}153.715{\mu}m$ 보다 20.7% 더 작은 것을 확인하였다.
요소-멜라민 공축합 수지의 요소와 멜라민 혼합비율이 합판의 포름알데히드 방출과 접착성에 미치는 영향
박헌,강은창,민경희,Park, Heon,Kang, Eun-Chang,Min, Kyeong-Heui 한국가구학회 2000 한국가구학회지 Vol.11 No.1
This study was to measure formaldehyde emission and bonding strength of plywoods manufactured with urea-melamine formaldehyde adhesives, which were made from three different mixing ratios of urea and melamine, and with four different formaldehyde/urea-melamine molar ratios of 1.0,1.1,1.2 and 1.4. The results were as follows 1. Amount of formaldehyde emission was the lowest at the first method of molar ratio(F/(M+U)) 1.0. Amounts of formaldehyde emission of experimental manufactured adhesives were lower than that of commercial adhesive. 2. Bonding strength of dry specimen was the highest at the first method of molar ratio(F/(M+U)) 1.4. Dry bonding strength of molar ratio(F/(M+U)) 1.4 was similar to commercial adhesive. 3. Bonding strength of wet specimen was the highest at the second method of molar ratio(F/(M+U)) 1.4. Bonding strength of wet specimen used by the third method of molar ratio(F/(M+U)) 1.4 was almost equal to commercial adhesive.