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박채민 ( Chae Min Park ),이의형 ( Ui Hyoung Lee ),이효종 ( Hyo Jong Lee ) 대한금속재료학회(구 대한금속학회) 2016 대한금속·재료학회지 Vol.54 No.6
Copper was electroplated using plating baths containing various concentrations of Janus Green B (JGB, C30H31ClN6) from 0 to 1 mM. The electrical resistance, microstructure and impurity concentration were investigated by using four point probe, electron backscattered diffraction, and glow discharge spectroscopy analyses, respectively. The initial sheet resistance of the Cu films was increased by increasing the JGB concentration, and the impurity concentrations of C, H and N also linearly increased. At 0.2 mM of JGB, while the sheet resistance decreased by 7% for the initial resistance, crystal growth did not occur. The initial decrease in electrical resistance was due to the redistribution of impurities, and grain boundary migration was inhibited by solute dragging. As a result, we were able to retard the recrystallization of Cu electrodeposits using the impurities from the JGB additive. (Received April 4, 2016)
김병렬 ( Byeung Ryeul Kim ),박채민 ( Chae Min Park ),이우진 ( Woo Jin Lee ),김인수 ( In Soo Kim ) 대한금속·재료학회 2010 대한금속·재료학회지 Vol.48 No.12
This study elucidates the formation mechanism of SnO plate observed during the precipitation reaction of a SnCl2 aqueous solution. Sn21Cl16(OH)14O6 and Sn6O4(OH)4 precipitates was formed at pH=3~5 and at pH=11, respectively. When the pH was in the range of 11.5~12.5, the Sn6O4(OH)4 precipitates dissolved into HSnO2 - [Sn6O4(OH)4+4OH-=6HSnO2 -+2H+] and dissolved HSnO2 - ions reprecipitated to SnO plate [HSnO2 -+H+=SnO+H2O]. The Sn6O4(OH)4 precipitates completely transformed into SnO plate through a repeated process of dissolution-precipitation in the range of pH=11.5~12.5.
도금전해액의 종류에 따른 수지상 구리 분말의 형상 및 표면적 특성
박다정(Da Jung Park),박채민(Chae-Min Park),강남현(Nam Hyun Kang),이규환(Kyu Hwan Lee) 한국표면공학회 2016 한국표면공학회지 Vol.49 No.5
We have investigated the effects of applied potential, deposition time and electrolyte types on shapes and physical properties of Cu dendrites by potentiostatic electrodeposition. Finer shape of dendrites was observed at less cathodic potential by 100mV than at the limiting current, due to ‘effective overpotential’. The shape of copper dendrite is related to the deposition time, too. The dendrite depositing for 10 min showed the finest shape. The finer dendrite has the less apparent density and the larger specific surface area. Dendrite from chloride solution has the lowest density and the largest surface area among three plating solutions, sulfate, chloride and pyrophosphate.
Cu 필라 솔더 범프의 리플로우 전후 형상변화 및 모델링
김상혁 ( Sang Hyuk Kim ),신한균 ( Han Kyun Shin ),박채민 ( Chae Min Park ),김동욱 ( Dong Uk Kim ),차필령 ( Pil Ryung Cha ),이의형 ( Ui Hyoung Lee ),이효종 ( Hyo Jong Lee ) 대한금속재료학회(구 대한금속학회) 2015 대한금속·재료학회지 Vol.53 No.7
A Cu pillar bump was fabricated by consecutive plating of Cu and Sn. Here, we investigated the change in shape of Sn, and the formation of intermetallic compound during the reflow process. At first, we made a cylindrical shape of Sn in various thickness and then, the Sn was changed into a truncated sphere (Sn bump) on a Cu pillar through the reflow process. When the Sn thickness was a third of the Cu pillar diameter, the reflowed bump radius had a minimum value and the bump-height change at that time had a maximum value. Such results were well understood based on the truncated sphere model.