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박정규(Jung-Kyu Park),조성학(Sung-Hak Cho),김재구(Jae-gu Kim),장원석(Won-seok Chang),황경현(Kyung-Hyun Whang),유병헌(Byung-Heon Yoo),김광열(Kwang-Ryul Kim) Korean Society for Precision Engineering 2009 한국정밀공학회지 Vol.26 No.5
The removal of tiny particles adhered to surfaces is one of the crucial prerequisite for a further increase in IC fabrication, large area displays and for the process in nanotechnology. Various cleaning techniques (wet chemical cleaning, scrubbing, pressurized jets and ultrasonic processes) currently used to clean critical surfaces are limited to removal of micrometer-sized particles. Therefore the removal of sub-micron sized particles from silicon wafers is of great interest. For this purpose various cleaning methods are currently under investigation. In this paper, we report on experiments on the cleaning effect of 100nm sized fluorescence particles on silicon wafer using the plasma shockwave occurred by femtosecond laser. The plasma shockwave is main effect of femtosecond laser cleaning to remove particles. The removal efficiency was dependent on the gap distance between laser focus and surface but in some case surface was damaged by excessive laser intensity. These experiments demonstrate the feasibility of femtosecond laser cleaning using 100nm size fluorescence particles on wafer.
조성학(Sung-Hak Cho),박정규(Jung-Kyu Park),김재구(Jae-Gu Kim),장원석(Won-Seok Chang),최두선(Doo-Sun Choi),황경현(Kyung-Hyun Whang) Korean Society for Precision Engineering 2010 한국정밀공학회지 Vol.27 No.6
Recent research topics of ultra-precision micro, nano machining using femtosecond lasers are described in the paper.