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Cu-Cu 접착부의 고온고습 내구성에 미치는 경화제 및 촉매제의 영향
민경은,김해연,방정환,김종훈,김준기,Min, Kyung-Eun,Kim, Hae-Yeon,Bang, Jung-Hwan,Kim, Jong-Hoon,Kim, Jun-Ki 한국재료학회 2011 한국재료학회지 Vol.21 No.5
As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.
민경은,이준식,유세훈,김목순,김준기,Min, Kyung-Eun,Lee, Jun-Sik,Yoo, Se-Hoon,Kim, Mok-Soon,Kim, Jun-Ki 한국재료학회 2010 한국재료학회지 Vol.20 No.12
The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.
MMT 첨가에 따른 Polyamide/MMT 나노복합체의 흡습 특성
민경은(Kyung Eun Min),박상철(Sang Cheol Park),김호겸(Ho Gyum Kim) 한국고분자학회 2013 폴리머 Vol.37 No.1
Pilot scale에서의 나노복합체의 상용화를 위해 용융 삽입법을 적용하고 이축 압출기로 제조한 polyamide/MMT 나노복합체의 흡습 특성을 연구한 결과, MMT 도입으로 수분 흡수율이 감소되었으며 그에 따라 치수 안정성이 향 상되었다. 굴곡강도 및 탄성률은 수분 흡수율이 증가함에 따라 저하되었으며, 이로부터 MMT의 도입은 강도 향상 효과와 함께 흡습방지를 통한 강도 저하 억제효과도 보이는 것으로 조사되었다. The melt intercalation to commercialize nanocomposites in a pilot scale was applied and the water absorption characteristics for polyamide/MMT nanocomposites manufactured by twin screw extruder was studied. As a result, water absorption decreased with the introduction of MMT and dimensional stability was improved. However, as water absorption increased, flexural strength and modulus were reduced. Therefore, the effect of MMT introduction on mechanical properties of nanocomposites was clearly observed, which may increase the level of strength by maintaining anti-water absorption property of nanocomposite.
민경은(Kyung-Eun Min),이준식(Jun-Sik Lee),이소정(So-Jeong Lee),이성(Sung Yi),김준기(Jun-Ki Kim) 대한용접·접합학회 2015 대한용접·접합학회지 Vol.33 No.5
The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.