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가상현실(Vritual Reality)을 활용한 소규모 영상 프로덕션의 가상제작 공정 최적화 설계 연구
김형재(Hyungjae Kim) 한국콘텐츠학회 2023 한국콘텐츠학회논문지 Vol.23 No.12
The evolution of contemporary imaging technologies has enhanced accessibility to video production, and in tandem with the expansion of digital media, has catalyzed a rise in the audiences diverse demands. This progression has led the film industry to focus on strategic competitiveness and the adoption of innovative production methodologies. Particularly, small-scale video production companies have turned their attention to cutting-edge technologies such as Virtual Production (VP). VP integrates digital technologies like real-time computer graphics, Virtual Reality (VR), Augmented Reality (AR), and motion capture, contributing significantly to the modernization of traditional production methods. The key advantages of this technology include the reduction of production costs and the quick realization of realistic scenes, thus highlighting its potential for application in the domain of video production. This study discusses the application of VP in small-scale video productions, suggesting an efficient production process design utilizing VP technology, even within the confines of limited resources. The primary focus is on selecting cost-effective hardware from the currently available VP equipment, examining its compatibility with various software to optimize it for different production settings. The methodology proposed was validated through productions that not only demonstrated reductions in production costs and time but also facilitated efficient communication within teams. Furthermore, it was observed that this approach enabled the achievement of a high degree of visual expressiveness, comparable to that of large-scale production companies VP outputs.
박범영(Boumyoung Park),김호윤(Hoyoun Kim),김형재(Hyungjae Kim),김구연(Gooyoun Kim),정해도(Haedo Jeong) Korean Society for Precision Engineering 2004 한국정밀공학회지 Vol.21 No.7
As a result of high integration of semiconductor device, the global planarization of multi-layer structures is necessary. So the chemical mechanical polishing(CMP) is widely applied to manufacturing the dielectric layer and metal line in the semiconductor device. CMP process is under influence of polisher, pad, slurry, and process itself, etc. In comparison with the general CMP which uses the slurry including abrasives, fixed abrasive pad takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing & erosion due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of fixed abrasive pad using hydrophilic polymers with swelling characteristic in water and explains the self-conditioning phenomenon. And the tungsten CMP using fixed abrasive pad achieved the good conclusion in terms of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.