http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
두께 균일도 향상을 위한 LPCVD 챔버 내 웨이퍼 온도 분포 분석
강승환(Seung-Hwan Kang),김병훈(Byeong Hoon Kim),공병환(Byung Hwan Kong),이재원(Jae Won Lee),고한서(Han Seo Ko) 한국가시화정보학회 2016 한국가시화정보학회지 Vol.14 No.2
The wafer temperature and its uniformity inside the LPCVD chamber were analyzed. The temperature uniformity at the end of the wafer load depends on the heat-insulating cap. The finite difference method was used to investigate the radiation and conduction heat transfer mechanisms, and the temperature field and heat diffusion in the LPCVD chamber was visualized. It was found that the temperature uniformity of the wafers could be controlled by the size and distance of the heat-insulating cap.