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Fault Diagnosis in Semiconductor Etch Equipment Using Bayesian Networks
Nawaz, Javeria Muhammad,Arshad, Muhammad Zeeshan,Hong, Sang Jeen The Institute of Electronics and Information Engin 2014 Journal of semiconductor technology and science Vol.14 No.2
A Bayesian network (BN) based fault diagnosis framework for semiconductor etching equipment is presented. Suggested framework contains data preprocessing, data synchronization, time series modeling, and BN inference, and the established BNs show the cause and effect relationship in the equipment module level. Statistically significant state variable identification (SVID) data of etch equipment are preselected using principal component analysis (PCA) and derivative dynamic time warping (DDTW) is employed for data synchronization. Elman's recurrent neural networks (ERNNs) for individual SVID parameters are constructed, and the predicted errors of ERNNs are then used for assigning prior conditional probability in BN inference of the fault diagnosis. For the demonstration of the proposed methodology, 300 mm etch equipment model is reconstructed in subsystem levels, and several fault diagnosis scenarios are considered. BNs for the equipment fault diagnosis consists of three layers of nodes, such as root cause (RC), module (M), and data parameter (DP), and the constructed BN illustrates how the observed fault is related with possible root causes. Four out of five different types of fault scenarios are successfully diagnosed with the proposed inference methodology.
Fault Diagnosis in Semiconductor Etch Equipment Using Bayesian Networks
Javeria Muhammad Nawaz,Muhammad Zeeshan Arshad,Sang Jeen Hong 대한전자공학회 2014 Journal of semiconductor technology and science Vol.14 No.2
A Bayesian network (BN) based fault diagnosis framework for semiconductor etching equipment is presented. Suggested framework contains data preprocessing, data synchronization, time series modeling, and BN inference, and the established BNs show the cause and effect relationship in the equipment module level. Statistically significant state variable identification (SVID) data of etch equipment are preselected using principal component analysis (PCA) and derivative dynamic time warping (DDTW) is employed for data synchronization. Elman’s recurrent neural networks (ERNNs) for individual SVID parameters are constructed, and the predicted errors of ERNNs are then used for assigning prior conditional probability in BN inference of the fault diagnosis. For the demonstration of the proposed methodology, 300 mm etch equipment model is reconstructed in subsystem levels, and several fault diagnosis scenarios are considered. BNs for the equipment fault diagnosis consists of three layers of nodes, such as root cause (RC), module (M), and data parameter (DP), and the constructed BN illustrates how the observed fault is related with possible root causes. Four out of five different types of fault scenarios are successfully diagnosed with the proposed inference methodology.
( Muhammad Zeeshan Arshad ),( Javeria Muhammad Nawaz ),( Sang Jeen Hong ) 한국정보처리학회 2014 Journal of information processing systems Vol.10 No.3
In this paper, we investigated the use of seasonal autoregressive integrated moving average (SARIMA) time series models for fault detection in semiconductor etch equipment data. The derivative dynamic time warping algorithm was employed for the synchronization of data. The models were generated using a set of data from healthy runs, and the established models were compared with the experimental runs to find the faulty runs. It has been shown that the SARIMA modeling for this data can detect faults in the etch tool data from the semiconductor industry with an accuracy of 80% and 90% using the parameter-wise error computation and the step-wise error computation, respectively. We found that SARIMA is useful to detect incipient faults in semiconductor fabrication.
Arshad, Muhammad Zeeshan,Nawaz, Javeria Muhammad,Hong, Sang Jeen Korea Information Processing Society 2014 Journal of information processing systems Vol.10 No.3
In this paper, we investigated the use of seasonal autoregressive integrated moving average (SARIMA) time series models for fault detection in semiconductor etch equipment data. The derivative dynamic time warping algorithm was employed for the synchronization of data. The models were generated using a set of data from healthy runs, and the established models were compared with the experimental runs to find the faulty runs. It has been shown that the SARIMA modeling for this data can detect faults in the etch tool data from the semiconductor industry with an accuracy of 80% and 90% using the parameter-wise error computation and the step-wise error computation, respectively. We found that SARIMA is useful to detect incipient faults in semiconductor fabrication.