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Calculation of current.voltage characteristics of a Cu (Ⅱ) complex/n-Si/AuSb Schottky diodeed
K. Akkılıç,Y.S. Ocak,T. Kılıçog˘lu,S. Ilhan,H. Temel 한국물리학회 2010 Current Applied Physics Vol.10 No.1
In this study, Cu (Ⅱ) complex/n-Si structure has been fabricated by forming a thin organic Cu (Ⅱ) complex film on n-Si wafer. It has been seen that the structure has clearly shown the rectifying behaviour and can be evaluated as a Schottky diode. The contact parameters of the diode such as the barrier height and the ideality factor have been calculated using several methods proposed by different authors from current.voltage (I-V) characteristics of the device. The calculated barrier height and ideality factor values from different methods have shown the consistency of the approaches. The obtained ideality factor which is greater than unity refers the deviation from ideal diode characteristics. This deviation can be attributed to the native interfacial layer in the organic/inorganic interface and the high series resistance of the diode. In addition, the energy distribution of the interface state density (Nss) in the semiconductor band gap at Cu (Ⅱ) complex/n-Si interface obtained from I-V characteristics range from 2.15 × 1013 cm-2 eV-1 at (Ec - 0.66) eV to 5.56 × 1012 cm-2 eV-1 at (Ec - 0.84) eV.
Determination of Interfacial Energies for Solid Al Solution in Equilibrium with Al-Cu-Ag Liquid
K. Ke lio lu,Y. Ocak,S. Aksöz,N. Mara ll,E. Çadlrll,H. Kaya 대한금속·재료학회 2010 METALS AND MATERIALS International Vol.16 No.1
The equilibrated grain boundary groove shapes of a solid Al solution in equilibrium with Al-Cu-Ag liquid were observed from a quenched sample using a radial heat flow apparatus. The Gibbs-Thomson coefficient,solid-liquid interfacial energy, and grain boundary energy of the solid Al solution were determined from the observed grain boundary groove shapes. The thermal conductivity of the solid phase for Al-16.42 at.% Ag-4.97at.% Cu and Al-16.57 at.% Ag-11.87 at.% Cu alloys and the thermal conductivity ratio of the liquid phase to the solid phase for Al-16.57 at.% Ag-11.87 at.% Cu alloy at the melting temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively.