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Interface modification in solar cell contact electrode using pre-cleaning treatment chemistries.
Cui, Yinhua,Kim, Areum,Lee, Seonjea,Choi, Eunmi,Yoon, Sung Pil,Pyo, Sung Gyu American Scientific Publishers 2014 Journal of nanoscience and nanotechnology Vol.14 No.12
<P>Promoting and employing photovoltaic power as an alternative energy source, the solar cell industry has made rapid strides. However, improving the efficiency of these solar cells using low-cost fabrication processes is still needed. The interface between the Si surface and the electrode plays a very important role in the process of electrode formation of the solar cell. In this study, the electrode interface underwent four different pre-treatments in order to enhance the efficiency of Si-based solar cells. We analyzed the adhesion properties at the interface between the Si wafer and the electrode and conducted an analysis of the variation in contact resistance between the two contact surfaces. To reduce the cost of the entire experiment, we replaced the existing Ag screen printing-based electrode fabrication method with a low-temperature, low-cost Ni/Cu electroless plating method. The test cells exhibited improved adhesion and therefore improved efficiency as compared to cells treated with the currently used diluted HF.</P>
최은미,Hee Soo Choi,Areum Kim,Seonjea Lee,Yinhua Cui,Soon Hyeong Kwon,Chang Hyun Kim,한상준,손형빈,표성규 대한금속·재료학회 2013 METALS AND MATERIALS International Vol.19 No.6
The wafer bonding process has become a flexible approach to material and device integration. The bonding strength in 3-dimensional processes is a crucial factor in various interface bonding processes such as silicon to silicon, silicon to metal, and oxide to adhesive intermediates. A method for measurement of bonding strength is proposed utilizing an ‘atomic force microscopy (AFM) applied carbon nanotube (CNT) probe tip’ which requires relatively simple preparation of sample and is able to measure bond strength regardless of film type. The bonding strength of the SiO2-Si surfaces cleaned with SPFM was 0.089 J/m 2 , while the bonding strength of surfaces cleaned with RCA 1 (NH4OH:H2O:H2O2) was 0.044 J/m 2 . This work verified the possibility that the new method is capable of accurately measuring bonding strength. It was also confirmed that more effective bonding is possible after cleaning with SPFM.