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Electromagnetic Susceptibility Analysis of I/O Buffers Using the Bulk Current Injection Method
Kwak, SangKeun,Nah, Wansoo,Kim, SoYoung The Institute of Electronics and Information Engin 2013 Journal of semiconductor technology and science Vol.13 No.2
In this paper, we present a set of methodologies to model the electromagnetic susceptibility (EMS) testing of I/O buffers for mobile system memory based on the bulk current injection (BCI) method. An efficient equivalent circuit model is developed for the current injection probe, line impedance stabilization network (LISN), printed circuit board (PCB), and package. The simulation results show good correlation with the measurements and thus, the work presented here will enable electromagnetic susceptibility analysis at the integrated circuit (IC) design stage.
Electromagnetic Susceptibility Analysis of I/O Buffers Using the Bulk Current Injection Method
SangKeun Kwak,Wansoo Nah,SoYoung Kim 대한전자공학회 2013 Journal of semiconductor technology and science Vol.13 No.2
In this paper, we present a set of methodologies to model the electromagnetic susceptibility (EMS) testing of I/O buffers for mobile system memory based on the bulk current injection (BCI) method. An efficient equivalent circuit model is developed for the current injection probe, line impedance stabilization network (LISN), printed circuit board (PCB), and package. The simulation results show good correlation with the measurements and thus, the work presented here will enable electromagnetic susceptibility analysis at the integrated circuit (IC) design stage.
Power Integrity and Shielding Effectiveness Modeling of Grid Structured Interconnects on PCBs
SangKeun Kwak,YoungSic Jo,JeongMin Jo,SoYoung Kim 대한전자공학회 2012 Journal of semiconductor technology and science Vol.12 No.3
In this paper, we investigate the power integrity of grid structures for power and ground distribution on printed circuit board (PCB). We propose the 2D transmission line method (TLM)-based model for efficient frequency-dependent impedance characterization and PCB-package-integrated circuit (IC) co-simulation. The model includes an equivalent circuit model of fringing capacitance and probing ports. The accuracy of the proposed grid model is verified with test structure measurements and 3D electromagnetic (EM) simulations. If the grid structures replace the plane structures in PCBs, they should provide effective shielding of the electromagnetic interference in mobile systems. An analytical model to predict the shielding effectiveness (SE) of the grid structures is proposed and verified with EM simulations.
Noise Injection Path의 주파수 특성을 고려한 IC의 전자파 전도내성 시험 방법에 관한 연구
곽상근(SangKeun Kwak),김소영(SoYoung Kim) 한국전자파학회 2013 한국전자파학회논문지 Vol.24 No.4
본 논문에서는 IC(Integrated Circuit) 전자파 전도내성 시험 방법인 BCI(Bulk Current Injection)와 DPI(Direct Power Injection)를 이용하여 1.8 V I/O 버퍼에 대한 IC 전자파 전도내성을 시험하였다. IC 전자파 전도내성 시험을 회로 해석기를 사용하여 시뮬레이션 할 수 있는 등가회로 모델(model)을 개발하고 검증하였다. BCI와 DPI의 주파수에 따른 forward 전력을 비교한 결과는 주파수 성분에 따라 실제 IC에 도달하는 전자파(electromagnetic, EM) 노이즈의 양이 제한됨을 보여준다. 시뮬레이션을 통해, 가해지는 RF(Radio Frequency) 노이즈가 전달되는 경로의 삽입손실을 구하여, 하나의 시험 방법만으로는 넓은 주파수 영역에서 실질적인 IC 전자파 내성시험의 어려움을 발견하였다. 따라서 규정된 시험 방법을 보완하여 넓은 주파수 영역의 노이즈에 대해 신뢰도 높은 IC 전자파 전도내성 시험 방법을 제안한다. In this paper, Integrated circuit(IC) electromagnetic(EM) conducted immunity measurement and simulation using bulk current injection(BCI) and direct power injection(DPI) methods were conducted for 1.8 V I/O buffers. Using the equivalent circuit models developed for IC electromagnetic conducted immunity tests, we investigated the reliability of the frequency region where IC electromagnetic conducted immunity test is performed. The insertion loss for the noise injection path obtained from the simulation indicates that using only one conducted immunity test method cannot provide reliable conducted immunity test for broadband noise. Based on the forward power results, we analyzed the actual amount of EM noise injected to IC. We propose a more reliable immunity test methods for broad band noise.