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Patterning of Thin Copper Films under UV Exposure in Chlorine-Based Liquids
Chattopadhyay K.K.,안일신,Cho Jongkyu,Kim Okkyung,Kwak Jiwoon,Kyoung Jaisun 한국물리학회 2006 THE JOURNAL OF THE KOREAN PHYSICAL SOCIETY Vol.48 No.6
Wet etching of thin copper films was achieved by using chlorine-based liquids, such as 1,2- dicholorethane or NaCl dissolved in water, under ultraviolet (UV) irradiation. The etching of the thin copper film was probed in-situ by using a spectroscopic ellipsometer, and the etch rate could be controlled by adjusting the exposure parameters. As UV is used in lithography, mask patterns can be transferred to a copper surface directly without resorting to a complex photoresist process. Easy control of the etch rate ranging from sub °A/s and use of nontoxic liquids such as 1,2-dicholoroethane and NaCl solution are major advantages of this novel technique.