http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
- 中文 을 입력하시려면 zhongwen을 입력하시고 space를누르시면됩니다.
- 北京 을 입력하시려면 beijing을 입력하시고 space를 누르시면 됩니다.
RISS 인기검색어
- 검색키워드
- 저자 : Intae Whoang (검색결과 1 건)
- 무료
- 기관 내 무료
- 유료
-
Intae Whoang,Chinkwan Cho,Jin Hee Hong,Dong Hee Son,Byung Yoon Lim,Jin Pyung Kim,Kijun Bang 대한전자공학회 2023 Journal of semiconductor technology and science Vol.23 No.5
At SK hynix Wafer Level Package (WLPKG) line, there are plenty of measuring and inspection steps to ensure the quality of High Bandwidth Memory (HBM). Although most of the measuring and inspection steps are handled automatically, some of the steps still need confirmation from line operators with their naked eye and skills. Since the operators' skills are different, sometimes it causes human errors, and these risks become chronic problems for the company. To solve this problem, Package & Test (P&T) group at SK hynix has been steadily promoting the inspection automation system using deep learning. However, deep learning has the disadvantage of not providing interpretation information, such as which area is actually defective in the target image and its shape for the ‘Excellent’ result of outputs. In this paper, we will introduce cases in which defect patterns are automatically extracted from inspection images taken during the SiN / SiO2 film deposition process by using two deep-learning segmentation models. The performance of the technology to be introduced was demonstrated by comparing the Mean IoU value between the extracted defect image and label mask. Through the proposed technology, we intend to contribute to unmanned inspection verification tasks in the future and accelerate the realization of Industry 4.0.
연관 검색어 추천
이 검색어로 많이 본 자료
활용도 높은 자료
