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Enhanced Thermal and Mechanical Properties of Polyimide/Graphene Composites
Wen Dai,Jinhong Yu,Yi Wang,Yingze Song,Hua Bai,Kazuhito Nishimura,Huiwei Liao,Nan Jiang 한국고분자학회 2014 Macromolecular Research Vol.22 No.9
Polyimide (PI)/graphene sheets (GSs) composites were prepared by solution blending. The incorporationof GSs into PI increased the thermal conductivity, thermal stability and mechanical properties of PI. The thermal conductivityof PI/GSs composites was significantly improved compared with that of neat PI from 0.254 to 1.002 W/mK; this can be attributed to the homogeneous dispersion of graphene and the formation of heat conduction pathway. Furthermore, the Young modulus of PI/GSs was raised up to 4.04 GPa, approximately two-fold enhancement incomparison with that of neat PI. In addition, the incorportation of GSs in PI indicated excellent optical transparencyat the lowest weight fractions of GSs and modified wettability of PI films.