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Sunkyu Kong,Bumhee Bae,Jung, Daniel H.,Kim, Jonghoon J.,Sukjin Kim,Chiuk Song,Jonghoon Kim,Joungho Kim Professional Technical Group on Microwace Theory a 2015 IEEE Transactions on Microwave Theory and Techniqu Vol. No.
<P>Wireless power transfer (WPT) technology has recently emerged as an innovative and promising technology, and its electromagnetic compatibility (EMC) has become a significant issue. In this study, we investigated the electromagnetic (EM) radiated emission and interference generated by WPT systems using resonant magnetic field coupling, especially in applications with multi-coil configurations. The change in coil resonance associated with multi-coil configurations was analyzed via the impedance profile. We measured the EM radiated emission and analyzed the results with respect to the coil resonance. An analog-to-digital converter chip was designed and fabricated to analyze the effect of electromagnetic interference (EMI). Based on measurement and simulation results, we verified that the EM radiated emission and interference increase at the series or parallel resonance peaks, depending on the source type. In addition, we verified that EMI can be reduced by using ferrite sheet shielding.</P>
공란란(Lanlan Kong),김형길(Hyounggil Kim),다니엘 김(Daniel J. Kim) 한국인터넷전자상거래학회 2015 인터넷전자상거래연구 Vol.15 No.3
The present study is aimed to demonstrate the causal relationships of muli-dimensional brand experience(sensory, affective, behavioral, intellectual) to pleasure and WOM intention, to investigate mediating effects of pleasure in the links between multi-dimensional brand experiences and WOM intention, and to explain the differences between South Korean and Chinese. The results are indicated as follows. First, brand experiences(sensory, affective, behavioral, intellectual) had positive effects on consumer’s pleasure in both sample. Second, it was demonstrated that brand experiences was significant causes on inducing consumers’ WOM intention for South Korean and Chinese consumers. Finally, it was demonstrated that pleasure had fully mediated in the relationship between brand experiences and WOM intention in all sample. The findings will help global marketers establish more efficient brand strategies according to the differences and similarities between South Korean and Chinese smartphone consumers.
Sukjin Kim,Jung, Daniel H.,Kim, Jonghoon J.,Bumhee Bae,Sunkyu Kong,Seungyoung Ahn,Jonghoon Kim,Joungho Kim IEEE 2015 IEEE transactions on components, packaging, and ma Vol.5 No.7
<P>As technology develops, the number of chips increases while the thickness of mobile products continuously decreases, which leads to the need for high-density packaging techniques with high numbers of power and signal lines. By applying wireless power transfer technology at the printed circuit board (PCB) and package levels, the number of power pins can be greatly reduced to produce more space for signal pins and other components in the system. For the first time, in this paper, we propose and demonstrate a high-efficiency PCB- and package-level wireless power transfer interconnection scheme. We enhance the efficiency by applying magnetic field resonance coupling using a matching capacitor. The proposed scheme can replace a high number of power interconnections with rectangular spiral coils to wirelessly transfer power from the source to the receiver at the PCB and package levels. The equivalent circuit model is suggested with analytic equations, which is then analyzed to optimize the test vehicle design. For the experimental verification of the suggested model, the $Z$ -parameter results obtained from the model-based equation and measurement of the designed and fabricated test vehicles are compared at up to 1 GHz. The power transfer efficiency from the source coil to the receiver coil in this scheme is able to reach 85.6%. Finally, we designed and fabricated a CMOS full-bridge rectifier and mounted it on the receiver board to convert the transferred voltage from ac voltage to dc voltage. A measured dc voltage of 2.0 V is sufficient to operate the circuit, which generally consists of 1.5 V devices.</P>
Interface slip of post-tensioned concrete beams with stage construction: Experimental and FE study
Hin Foo Low,Sih Ying Kong,Daniel Kong,Suvash Chandra Paul 사단법인 한국계산역학회 2019 Computers and Concrete, An International Journal Vol.24 No.2
This study presents experimental and numerical results of prestressed concrete composite beams with different casting and stressing sequence. The beams were tested under three-point bending and it was found that prestressed concrete composite beams could not achieve monolith behavior due to interface slippage between two layers. The initial stress distribution due to different construction sequence has little effect on the maximum load of composite beams. The multi-step FE analyses could simulate different casting and stressing sequence thus correctly capturing the initial stress distribution induced by staged construction. Three contact algorithms were considered for interaction between concrete layers in the FE models namely tie constraint, cohesive contact and surface-to-surface contact. It was found that both cohesive contact and surface-to-surface contact could simulate the interface slip even though each algorithm considers different shear transfer mechanism. The use of surface-to-surface contact for beams with more than 2 layers of concrete is not recommended as it underestimates the maximum load in this study.
Song, Chiuk,Kim, Hongseok,Jung, Daniel H.,Kim, Jonghoon J.,Kong, Sunkyu,Kim, Jiseong,Ahn, Seungyoung,Kim, Jonghoon,Kim, Joungho [Institute of Electrical and Electronics Engineers 2016 IEEE transactions on electromagnetic compatibility Vol.58 No.4
<P>Wireless power transfer ( WPT) technology is an electrically safe and convenient method of charging batteries. WPT technology allows elimination of exposed contacts, which can cause direct electrocution of human. In spite of the great advantages, the WPT system inevitably generates strong electromagnetic fields ( EMFs), causing interference on the nearby electrical devices as well as harmful influence on human health. Therefore, it is important to satisfy EMF guidelines and reduce leakage magnetic field harmonics in WPT system. For the first time, in this paper, we propose a new tightly coupled handheld resonant magnetic field ( HH-RMF) charger operating at 20 kHz with low EMF and high efficiency. Using a guided magnetic flux in resonance structure, 64.5 mG of EMF is reduced compared to the conventional inductive charger at a distance of 200 mm from edge of the core. In addition to the electromagnetic interference ( EMI) reduction, the isolation inductor scheme is proposed as an EMI reduction method. Through a series of measurements, we experimentally verified that the proposed HH-RMF charger complies with the regulations published by the International Commission on Non-Ionizing Radiation Protection in 1998. The proposed HH-RMF charger with the isolation inductor scheme successfully reduces the third harmonic of the Tx and Rx currents by 23.4 and 11.8 dB mu A, respectively. Furthermore, the third and fifth magnetic field harmonics reduce by 1.38 and 0.67 mG, respectively. The coil-to-coil power transfer efficiency and total system power transfer efficiency of the proposed structure are maintained at over 98% and 84%, respectively.</P>
Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials
Shim, Jaewoo,Bae, Sang-Hoon,Kong, Wei,Lee, Doyoon,Qiao, Kuan,Nezich, Daniel,Park, Yong Ju,Zhao, Ruike,Sundaram, Suresh,Li, Xin,Yeon, Hanwool,Choi, Chanyeol,Kum, Hyun,Yue, Ruoyu,Zhou, Guanyu,Ou, Yunbo American Association for the Advancement of Scienc 2018 Science Vol.362 No.6415
<P><B>Cleaving with a metal handle</B></P><P>Using adhesive tape to pull off monolayers of two-dimensional (2D) materials is now a well-established approach. However, the flakes tend to be micrometer scale, and the creation of multilayer stacks for device application can be challenging and time consuming. Shim <I>et al.</I> show that monolayers of a variety of 2D materials, including molybdenum disulfide and hexagonal boron nitride, can be cleaved from multilayers grown as 5-centimeter-diameter wafers. The multilayer is capped with a nickel layer, which can be used to pull off the entire grown stack. The bottom of the stack is again capped with nickel, and a second round of cleaving leaves the monolayer on the bottom nickel layer. The monolayers could be transferred to other surfaces, which allowed the authors to make field-effect transistors with high charge-carrier mobilities.</P><P><I>Science</I>, this issue p. 665</P><P>Although flakes of two-dimensional (2D) heterostructures at the micrometer scale can be formed with adhesive-tape exfoliation methods, isolation of 2D flakes into monolayers is extremely time consuming because it is a trial-and-error process. Controlling the number of 2D layers through direct growth also presents difficulty because of the high nucleation barrier on 2D materials. We demonstrate a layer-resolved 2D material splitting technique that permits high-throughput production of multiple monolayers of wafer-scale (5-centimeter diameter) 2D materials by splitting single stacks of thick 2D materials grown on a single wafer. Wafer-scale uniformity of hexagonal boron nitride, tungsten disulfide, tungsten diselenide, molybdenum disulfide, and molybdenum diselenide monolayers was verified by photoluminescence response and by substantial retention of electronic conductivity. We fabricated wafer-scale van der Waals heterostructures, including field-effect transistors, with single-atom thickness resolution.</P>
A single port surgical robot system with novel elbow joint mechanism for high force transmission
Hwang, Minho,Yang, Un-Je,Kong, Deokyoo,Chung, Deok Gyoon,Lim, June-gi,Lee, Dong-Ho,Kim, Daniel H.,Shin, Dongsuk,Jang, Taeho,Kim, Jeong-Whun,Kwon, Dong-Soo Wiley (John WileySons) 2017 INTERNATIONAL JOURNAL OF MEDICAL ROBOTICS AND COMP Vol.13 No.4