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전기도금된 Cu-Sn과 Ni preplated frame의 특성 비교
이대훈(D. H. Lee),장태석(T. S. Jang),홍순성(S. S. Hong),이지원(J. W. Lee),양형우(H. W. Yang),한병근(B. K. Hahn) 한국표면공학회 2006 한국표면공학회지 Vol.39 No.6
In order to improve the performance of PPFs (Pre-Plated Frames), a PPF that employed a Cu-Sn alloy instead of conventionally used Ni was developed and then its properties were investigated. It was found that the electoplated Cu-Sn alloy layer was a mixture of uniformly distributed fine crystallites, resulting in better wettability and crack resistance than those of Ni PPF. Moreover, as in Cu/Ni/Pd/Au PPF, migration of copper atoms from the base metal to the top of the Cu/Cu-Sn/Pd/Au PPF surface was not found although the Cu-Sn layer itself contained considerable amount of copper. It was expected that, by using the newly developed Cu-Sn PPF, any possible heat generation and signal interrupt caused by an external electro-magnetic field could be reduced because the Cu-Sn layer was paramagnetic, i.e., nonmagnetic.