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하상백,임종고,김성헌,최환,이종찬 한국공작기계학회 2000 한국공작기계학회 추계학술대회논문집 Vol.2000 No.-
Experimental investigations were carried out to find the characteristics of grinding of ceramics. Grinding mechanisms of ceramics were inspected through the microscopic examination. It has been found that the specific grinding energy of ceramics is relatively low as compared to that of steels. The specific grinding energy affects the surface roughness and the residual stress of ground surface. The experimental results indicate that the rougher surface finish and higher compressive residual stress are obtained at lower specific grinding energy. The surface roughness and the residual stress of the ground surface have significant effects on the strength of ground piece of ceramics.
이종찬,강용구,이태원,전영길,하상백 金烏工科大學校 1998 論文集 Vol.19 No.-
Structural ceramics have been widely used in engineering parts. It, however, is very difficult to grind the ceramics with desired shape and dimensional accuracy because of their high hardness, strength, and brittleness. Grindability of structural ceramics are quite different as they have different mechanical and physical properties. This paper compares the grindability of structural ceramics such as Al₂O₃Si₃N₄and SiC. The grinding experiments include the measurement of grinding force, surface roughness. and SEM observation. The experimental results indicate that Si₃N₄consumes the highest specific grinding energy among the three kinds of ceramics. It was also found that there is no corelationship between grindability and surface roughness of ground surface.
하상백(S. B. Ha),최성주(S. J. Choi),안대균(D. K. Ahn),김인수(I. S. Kim),최영휴(Y. H. Choi) 한국정밀공학회 2006 한국정밀공학회 학술발표대회 논문집 Vol.2006 No.5월
In recent years, the higher flatness level in wafer shape has been strictly demanded with a high integration of the semiconductor devices. It has become diffcult for a conventional wafer preparing process to satisfy those demands. In order to meet those demands, surface grinding with in-feed grinder is adopted. In an in-feed grinding method, a chuck table for fixing a semiconductor wafer rotates on its rotation axis with a slight tilt angle to the rotation axis of a cup shaped grinding wheel and the grinding wheel in rotation moves down to grind the wafer. So, stability of the grinder structure is very important to aquire a wafer of good quality. This paper describes the features of the in-feed grinder and some FEM analysis results of the grinder structure.