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고온가압으로 소결한 고순도 이트리아 세라믹 소결체의 산화반응 특성
최진삼,신동우,배원태,Choi, Jinsam,Shin, Dong Woo,Bae, Won Tae 한국세라믹학회 2013 한국세라믹학회지 Vol.50 No.3
We investigated the characteristics of hot-pressed pure yttria ceramics, and annealed them in an oxidation atmosphere. Regardless of the heat treatment in the oxidation atmosphere, XRD analysis showed that all the samples had a $Y_2O_3$ phase without structural change. Even though the color variation of the hot-pressed $Y_2O_3$ ceramics was due to the sintering temperatures, the oxidation process turned the color of the $Y_2O_3$ ceramics into white. The color change during oxidation treatment appears to be related to oxygen defects. In addition, oxygen defects also affected the weight change and microstructure of the $Y_2O_3$ ceramics. The $Y_2O_3$ ceramic sintered at $1600^{\circ}C$ had a $5.03g/cm^3$ density, which is close to the theoretical density of $Y_2O_3$. As the sintering temperature increased, small homogeneous grains grew to large grains which affected the Vickers hardness. $Y_2O_3$ ceramics hot-pressed at $1600^{\circ}C$ and annealed at $1200^{\circ}C$ had a flexural strength of 140MPa.
X-ray 회절의 반치전폭(FWHM)을 이용한 Y-TZP세라믹스에서 반복 열응력에 의한 입계크기 분석
최진삼,박규열,공영민,Choi, Jinsam,Park, Kyu Yeol,Kong, Young-Min 한국재료학회 2019 한국재료학회지 Vol.29 No.4
As a case study on aspect ratio behavior, Kaolin, zeolite, $TiO_2$, pozzolan and diatomaceous earth minerals are investigated using wet milling with 0.3 pai media. The grinding process using small media of 0.3 pai is suitable for current work processing applications. Primary particles with average particle size distribution D50, ${\sim}6{\mu}m$ are shifted to submicron size, D50 ${\sim}0.6{\mu}m$, after grinding. Grinding of particles is characterized by various size parameters such as sphericity as geometric shape, equivalent diameter, and average particle size distribution. Herein, we systematically provide an overview of factors affecting the primary particle size reduction. Energy consumption for grinding is determined using classical grinding laws, including Rittinger's and Kick's laws. Submicron size is obtained at maximum frictional shear stress. Alterations in properties of wettability, heat resistance, thermal conductivity, and adhesion increase with increasing particle surface area. In the comparison of the aspect ratio of the submicron powder, the air heat conductivity and the total heat release amount increase 68 % and 2 times, respectively.
Joining Behavior of YSZ Ceramics to Al2O3-ZrO2-SiO2-R2O and Al2O2-ZrO2-SiO2–La2O3–R2O Glass Systems
최진삼,배원태 한국세라믹학회 2015 한국세라믹학회지 Vol.52 No.1
The joining behavior of YSZ ceramics to the glasses used in the 9Al2O3-24ZrO2-51SiO2-16R2O and 9Al2O3-24ZrO2-51SiO2- 7La2O3-9R2O (wt%) glass systems was investigated. The glass transition and softening temperatures were determined to be 430oC and 760oC, respectively. The behavior of the contact angle was inversely proportional to an increase in the temperature. The Zr element in YSZ acted as a nucleation agent and contributed to the bonding behavior at the interface.
습식분쇄에 의한 입자크기 변화에 따른 분쇄입자의 종횡비 거동
최진삼,Choi, Jin Sam 한국재료학회 2020 한국재료학회지 Vol.30 No.5
As a case study on aspect ratio behavior, Kaolin, zeolite, TiO<sub>2</sub>, pozzolan and diatomaceous earth minerals are investigated using wet milling with 0.3 mm media. The grinding process using small media of 0.3 pai is suitable for current work processing applications. Primary particles with average particle size distribution D<sub>50</sub>, ~6 ㎛ are shifted to submicron size, D<sub>50</sub> ~0.6 ㎛ after grinding. Grinding of particles is characterized by various size parameters such as sphericity as geometric shape, equivalent diameter, and average particle size distribution. Herein, we systematically provide an overview of factors affecting the primary particle size reduction. Energy consumption for grinding is determined using classical grinding laws, including Rittinger's and Kick's laws. Submicron size is obtained at maximum frictional shear stress. Alterations in properties of wettability, heat resistance, thermal conductivity, and adhesion increase with increasing particle surface area. In the comparison of the aspect ratio of the submicron powder, the air heat conductivity and the total heat release amount increase 68 % and 2 times, respectively.
Sheath Heater 모듈 실링용 B2O3-ZnO-Bi2O3계 유리소재 및 첨가제에 따른 물성 변화
최진삼,신동우,배원태 한국세라믹학회 2013 한국세라믹학회지 Vol.50 No.1
We investigated the thermal and electrical properties of the B2O3-ZnO-Bi2O3 glass system as a sealing material in sheath heater modules. A composition with over 90 wt% Bi2O3 in the B2O3-ZnO-Bi2O3 system was glassified by controlling the cooling rate. The glass transition temperature and thermal expansion coefficient in bismate glass could be controlled by the minor ingredients of ZnO, SiO2, BaO2, and K2O. The B2O3-ZnO-Bi2O3 glass system bonded well to metal, and bismate glass insulating properties were comparable to those of bismate glass B2O3-ZnO-PbO glass system in a sheath heater module.
중금속 창연산화납계 저온유리 분말을 이용한 세라믹스/금속의 접합거동
최진삼,Choi, Jin Sam 한국세라믹학회 2014 한국세라믹학회지 Vol.51 No.4
The joining behavior of forsterite ceramics to SUS304 alloy using $8PbO-78Bi_2O_3-8B_2O_3-4ZnO-2SiO_2$ (wt%) system glass frit was investigated. The contact angle was smaller than $90^{\circ}$ at a temperature of $460^{\circ}C$. Redox reaction at the interface between forsterite and SUS304 was found to appear when the electrons in the metal part moved toward the glass part and the oxygen ions in glass moved to the metal side. The decrease of the surface tension due to the PbO solubility on the forsterite side contributed to the better wetting behavior at low temperature.
최진삼,배원태,Choi, Jinsam,Bae, Won Tae 한국세라믹학회 2015 한국세라믹학회지 Vol.52 No.1
The joining behavior of YSZ ceramics to the glasses used in the $9Al_2O_3-24ZrO_2-51SiO_2-16R_2O$ and $9Al_2O_3-24ZrO_2-51SiO_2-7La_2O_3-9R_2O$ (wt%) glass systems was investigated. The glass transition and softening temperatures were determined to be $430^{\circ}C$ and $760^{\circ}C$, respectively. The behavior of the contact angle was inversely proportional to an increase in the temperature. The Zr element in YSZ acted as a nucleation agent and contributed to the bonding behavior at the interface.
금속 필러가 첨가된 Pb-B-O계 유리와 Ni-Cr 합금 와이어 간의 전기 화학적 반응과 단락 거동
최진삼,다타치카 나까야마,Choi, Jin Sam,Nakayama, Tadachika 한국재료학회 2021 한국재료학회지 Vol.31 No.8
The electrochemical reaction between lead borate glass frit doped with Sn metal filler and Ni-Cr wire of a J-type resistor during a term of Joule heating is investigated. The fusing behavior in which the Ni-Cr wire is melted is not observed for the control group but measured for the Sn-doped specimen under 30 V and 500 mA. The Sn-doped lead borate glass frit shows a fusing property compared with other metal-doped specimens. Meanwhile, the redox reaction significantly contributes to the fusing behavior due to the release of free electrons of the metal toward the glass. The electrons derived from the glass, which used Joule heat to reach the melting point of Ni-Cr wire, increase with increasing corrosion rate at interface of metal/glass. Finally, the confidence interval is 95 ± 1.95<sub>9</sub> %, and the adjusted regression coefficient, R in the optimal linear graph, is 0.93, reflecting 93% of the data and providing great potential for fusible resistor applications.
Pb 금속필러가 첨가된 PbO-Bi<sub>2</sub>O<sub>3</sub>-B<sub>2</sub>O<sub>3</sub>-ZnO-SiO<sub>2</sub>계 유리의 특성
최진삼,정대용,신동우,배원태,Choi, Jinsam,Jeong, DaeYong,Shin, Dong Woo,Bae, Won Tae 한국세라믹학회 2013 한국세라믹학회지 Vol.50 No.3
We investigated the effect of Pb-metal filler added to a hybrid paste(PbO-$Bi_2O_3-B_2O_3$-ZnO glass frit and Pb-powder), for joining flip-chip sat lower temperatures than normal. The glass transition temperature was detected at $250^{\circ}C$ and the softening point occurred at $330^{\circ}C$. As the temperature increased, the specific density decreased due to the volatility of the Pb-metal and boron component in the glass. When the glass was heat-treated at $350^{\circ}C$ for 5 min, XRD results revealed a crystalline $Pb_4Bi_3B_7O_{19}$ phase that had been initiated by the addition of Pb-filler in the hybrid paste. The addition of the Pb-metal filler caused are action between the Pb-metal and glass that accelerated the formation of the liquid phase. The liquid phase that formed, promoted bonding between the flip-chip substrate sat lower temperature.