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에어 스퀴즈 필름의 맥놀이 현상을 이용한 촉감 생성 장치
지현수(Hyun-su Ji),류제하(Jeha Ryu) 한국HCI학회 2012 한국HCI학회 학술대회 Vol.2012 No.1
장치 표면에서 느껴지는 질감을 통해 조작자는 몰입감있는 원격조작 또는 전자기기와의 풍부한 인터페이스를 할 수 있다. 기존 Colgate 의 촉감제시장치는 스퀴즈 필름 이펙트(squeeze film effect)를 이용하여, 작은 진폭의 초음파로 판을 가진 시켜주어 판의 마찰계수가 바뀐 것 같은 효과를 만들어 내는 것이었다. 그리고 스틱슬립 현상을 이용한 촉감생성장치가 있었는데, 액추에이터를 주기적으로 켜주고 꺼줌으로써 스틱슬립의 주파수에 따른 다양한 촉감을 만들어 주었다. Colgate 의 촉감생성장치에 스틱슬립 현상을 이용한 촉감을 만들기 위해 액추에이터를 주기적으로 켜주고 꺼줬지만 액추에이터의 과도응답으로 소음이 크고 유리판이 손가락을 치는 듯한 촉각 노이즈도 나타났다. 본 논문에서는 맥놀이 현상을 이용하여 액추에이터의 갑작스러운 온-오프로 인한 소음과 촉각 노이즈를 제거하였다. 그리고 다차원 척도법을 통하여 스틱슬립 주파수에 따라 세 가지 촉감을 생성할 수 있음을 확인하였다. Operators can be immersed in controlling manipulators to communicate with personal electrics in plenty by the texture. Existing tactile display device uses squeeze film effect to modulate friction. Low amplitude and ultrasonic vibration of a plate makes air squeeze film between the plate and the fingertip. The tactile display device also uses ultrasonic vibration to generate tactile sensations. Besides, he found a way to make rougher sensations via stick-slip effect used a method of periodically turning on-off actuators. In the above point of view, I have tried to stick-slip effect to Colgate's tactile display device at the resonant frequency. However, sound noises and tactile noises like hitting the fingertip from the surface happen due to transient response of the actuator. My proposed tactile display device is inspired by Colgate's tactile display. Beating method removes sound noises and tactile noises. Moreover, stick-slip frequency caused by beating makes several tactile sensations according to frequency range. I conducted user study to confirm performances of tactile display and used Multi-Dimensional Scaling method to interpret the user study data. A perceptual map from 16 tactile stimuli consisted of different stick-slip frequency which shows that three different tactile cluster were separated by frequency range.
LED 면광원의 균일한 조도 분포를 갖는 Pattern 설계
김지혜(KIM Ji-hye),허지민(HEO Ji-min),이지훈(LEE Ji-hoon),유한제(YU Han-jae),마성민(MA Seong-min),지현수(JI Hyun-su),정미숙(JEONG Mee-suk) 한국생산제조학회 2011 한국생산제조시스템학회 학술발표대회 논문집 Vol.2011 No.4
This study is about a pattern design on LGP(Light Guide Panel). Using an LED, there is 2 kinds of system to make FFL. One of the systems is direct type which arranges an LED in a PCB substrate. Direct type has higher Light efficiency and more uniformity of illumination distribution then other system, but direct type has dazzling and a problem in a hot spot. To reduce such problems, This paper studied method to put pattern in a LGP upper part.
특허분석을 통한 공작기계 이송계의 기술 현황과 발전방향
은인웅(In-Ung Eun),지현수(Hyun Su Chee),이지원(Ji Won Lee) Korean Society for Precision Engineering 2012 한국정밀공학회지 Vol.29 No.5
Feed drive systems are used to position the machine tool components carrying the cutting tool and workpiece to the desired location. Hence, their positioning accuracy and speed determine the quality and productivity of machine tools. In this paper, technical trend of machine tools feed drive systems are analyzed by patent mapping. And this paper suggested future development direction of feed drive systems. The analysis is carried out by using problem solution map (PSM) for the applied patent during January 2000 and December 2009 in Korea, Japan, EU and U.S.A.
PECVD 공정 반응 가스 유속 및 분포 제어를 통한 SiON 두께 산포 개선 연구
박광수(Gwangsu Park),장응규(Eung Ku Jang),지현수(Hyun su JI),한규진(Gyujin Han),최지운(Jiwoon Choi),전희성(Hui seong Jeon),신진우(Jin woo Shin),김진용(Jinyong Kim),최철환(Chul hwan Choi),김환우(Michel Kim),김경태(Kyung Tae Kim),정병훈(B 대한전자공학회 2023 대한전자공학회 학술대회 Vol.2023 No.11
In this study, the thin film thickness dispersion was improved through the distribution and improvement of the reaction gas flow rate in the SiON PECVD process. The flow of the reaction gas was analyzed using computational hydrodynamics (CFD), and it was confirmed that the flow rate of the fluid in the center of the wafer was small and the deposition rate in the center of the wafer was high. Therefore, an experiment was conducted to change the hole diameter and distribution of the shower head in the direction of lowering the deposition rate by increasing the flow rate of the fluid near the center of the wafer, and under optimal hole diameter and distribution conditions, a uniform thin film improved by 68.47% compared to the previous one was obtained. Through this study, it was possible to improve the process capability of old facilities to a level equivalent to that of new facilities, and it is expected to be used as a base technology to improve the process capability of other PECVD old facilities..