http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
서종철,한학수,박성국,정현수,조영일 연세대학교 산업기술연구소 1996 논문집 Vol.28 No.2
The object of this study is to demonstrate that residual stress behaviors in different polyimide thin films depend on the degree of chain rigidity according th to polyimide backbone structure, curing history and precursor type. The comparison of the residual stress indicates that residual stress of a polyimide thin film is primarily dependent on the polymer chain rigidity, fully rodike PMDA-PDA, semi-flexible PMDA-ODA and flexible BTDA-ODA polymides. The higher polymer chain rigidity of polyimide thin films shows the lower residual stress in tension on the Si wafer substrate. Among the polyimide thin films studied here, BTDA-ODA polyimide exhibit the highest overall residual stress in spite of relatively low transition temperature.
조영일,한학수,정현수,황재욱 한국화학공학회 1999 Korean Chemical Engineering Research(HWAHAK KONGHA Vol.37 No.1
Poly(p-phenylene pyromellitimide) (PMDA-PDA)와 poly(4,4'-oxydiphenylene pyromellitimide) (PMDA-ODA)를 각각의 poly(amirs acid) 및 poly(amic diethyl ester)전구체로부터 제조하였다. 이들 박막에 대하여, Thin Film Stress Analyzer(TESA)를 이용하여 폴리이미드 박막의 잔류 음력거동은 공정온도(25-400℃) 하에서 전구체의 열적 이미드화에 따라 실시간으로 측정되었고, 수분 흡수에 따른 응력 완화 현상은 25℃와 100%상대 습도하에서 수정된 Fick's law를 적용하여 모사하였다. 또한, 전구체의 종류에 따른 모폴로지와 잔류 응력거동과 관계는 WAXD을 이용하여 조사되었다. 폴리이미드 박막의 잔류 응력은 PMDA-ODA(PAA)-PMDA-ODA(PAE)>PMDA-PDA(PAE)>PMDA-PDA(PAA) 순이었고, 박막 내부로의 수분 확산 속도는PMDA-ODA(PAA)>PMDA-ODA(PAE)>PMDA-PDA(PAE)>PMDA-PDA(PAA) 순이었다. 결과적으로, 폴리이미드 박막의 잔류 응력과 박막내로의 수분 흡수에 의한 응력 완화 거동은 전구체 종류와 이미드화 과정에 따른 폴리이미드의 모폴로지(사슬 강직도, 질서도, 배향도) 변화와 관련성이 있게 나타났다. 또한, 100% 습도에서 측정된 폴리이미드 박막에 대한 응력 완화 계수는 전자 미세 저울로 측정한 수분 확산도와 일치하는 경향을 나타내었다. Poly(p-phenylene pyromellitimide) (PMDA-PDA) and poly(4,4'-oxydiphenylene pyromellitimide) (PMDA-ODA) films were prepared from their poly(amic acid) (PAA) and poly(amic diethyl ester) (PAE) precursors. For these thin films, residual stresses were detected in-situ during thermal imidization of the polyimide precursors as a function of processing temperature over the range 25-400 ℃ using thin film stress analyzer, whereas moisture-induced stress relaxation was simulated as a function of time in 100 % relative humidity at 25℃ by a modified Fick's law. In addition, their relationship between morphological structures and residual stress behaviors depending on precursor origins were investigated by X-ray diffraction. In comparison, the residual stress was in the increasing order PMDA-ODA(PAA)-PMDA-ODA(PAE)>PMDA-PDA(PAE)>PMDA-PDA(PAA) and coefficient of water diffusion into thin films was in the increasing order PMDA-ODA(PAA)>PMDA-ODA(PAE)>PMDA-PDA(PAE)>PMDA-PDA(PAA). Conclusively, the residual stress and the stress relaxation behaviors induced by water diffusion kinetics were strongly affected by the morphology nature (chain rigidity, chain order, orientation) depending on the precursor origins and imidization step. In addition, stress relaxation coefficients for these polyimide films measured at 100 % relative humidity show consistent trend with water diffusivity of polyimide thin films measured by electro-microbalance.