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투자율이 높은 NiFe 코어를 이용한 마이크로 트랜스포머 제작
조세준,차두열,이재혁,이수진,장성필,Cho, Se-Jun,Cha, Doo-Yeol,Lee, Jai-Hyuk,Lee, Soo-Jin,Chang, Sung-Pil 한국전기전자재료학회 2010 전기전자재료학회논문지 Vol.23 No.3
Recently as the electronic devices are getting to be more and more smaller, transformers are needed to be micro fabricated using MEMS technology. In this paper transformers have been fabricated and measured by depositing insulation layer to reduce the loss of eddy current and in the middle core a high permeability permalloy was designed based on the turns ratio between primary coil and secondary coil which are 1:1 transformers. (the number of turns of primary coil and secondary coil: 3/3, 5/5, 7/7). The size of the transformers including ground shield are $1mm{\times}1.5mm$, $1mm{\times}1.95mm$, $1mm{\times}2.35mm$ respectively. The line width, pitch and the height of post are 50um. Based on the measured data from the micro fabricated transformers, the 3/3 turns in the primary coil and secondary coil showed the lowest insertion loss with 1.5 dB at 480 MHz and the 7/7 turns in the primary coil and secondary coil showed the highest insertion loss with 2.5 dB at 280 MHz. Also confirmed that the bandwidth goes up as the number of turns goes down. There was some difference between the actual measured data and the HFSS simulation result. It looks as if it is an error of the difference between oxidation of copper or the permeability of SU-8.
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전류모드에 따른 전해도금된 마이크로 비아의 전기적 특성 연구
차두열,강민석,조세준,장성필,Cha, Doo-Yeol,Kang, Min-Suck,Cho, Se-Jun,Jang, Sung-Pil 한국전기전자재료학회 2009 전기전자재료학회논문지 Vol.22 No.2
In order to get more higher integration density of devices, it is getting to be used more and more micro via interconnection lines for interconnecting layers or devices. However, it is very important to enhance the electrical characteristic by reducing the electrical resistivity of micro via interconnection line because it affects the reliability of packaging. In this paper, Micro vias were patterned with a diameter from 10 to 100 um by increasing the step of 10 um and 100 um height and were fabricated by micromachining technology to investigate the electrical characteristic of micro via interconnection lines. These micro vias were filled with copper by electroplating process with appling pulse current mode. And the electrical characteristics of micro via interconnection lines were measured. The measured value of electrical resistivity shows with a range from 20 to $26\;m{\Omega}$. This value from micro via interconnection lines fabricated by pulse current mode electroplating process shows better result than the resistivity from than micro via interconnection lines fabricated by DC mode ($31\;m{\Omega}$).
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김성태,차두열,강민석,조세준,장성필,Kim, Sung-Tae,Cha, Doo-Yeol,Kang, Min-Suck,Cho, Se-Jun,Jang, Sung-Pil 한국전기전자재료학회 2009 전기전자재료학회논문지 Vol.22 No.1
Air core based transformers have been designed, simulated and fabricated by using micromachining process for the application of wireless power transmission with the range of frequency from 1 GHz to 20 GHz. Fabricated transformers are the types of solenoid transformers with primary and secondary coils. the size of fabricated transformer is $1.1{\times}1.5{\sim}2.15\;mm$ including ground shield. Transformers have been measured by dividing two groups based on the turns ratio between primary coil and secondary coil which are 1:1 transformers(the number of turns of primary coil and secondary coil: 3/3, 5/5, 7/7) and l:n transformers(the number of turns of primary coil and secondary coil: 3/3, 3/6, 3/9). As a result of the measurement, the lowest insertion loss of transformers ranged from 2 dB to 2.8 dB according to the number of turns between primary coil and secondary coil. And the lowest insertion loss from the transformers was measured at the frequency from 7 GHz to 11 GHz according to the number of turns between primary coil and secondary coil. Based on the measurement data from the microfabricated transformers, the transformer with the 3/3 turns in the primary coil and secondary coil showed best performance compared to others in terms of lowest insertion loss, lowest insertion loss frequency and bandwidth.
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