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KMPR을 이용한 다층구조물 제작 및 전해도금을 이용한 니켈몰드 제작
황성진(Sung Jin Hwang),정필구(Phill Gu Jung),고정상(Jeung Sang Ko),고종수(Jong Soo Ko),정임덕(Im Deok Jeong),김인곤(In Gon Kim) 한국정밀공학회 2006 한국정밀공학회 학술발표대회 논문집 Vol.2006 No.5월
In this paper, we proposed XP KMPR-1050 negative tone resist to replace SU-8 resist for multi-layer microstructures and thick plating mold fabrication using UV-LIGA process. XP KMPR resist proposed in this paper can be easily striped using a common stripping solution such as NMP without damage of micro-structure. The conditions for the fabrication of XP KMPR micro-structure were optimized by adjustment of exposure and post-exposure bake(PEB). The 140㎛-thick and an aspect ratio at least 10 micro-structure and multi-layer structures were successfully fabricated through the process conditions. Through-mold electroplating and PR striping of XP KMPR has been successfully demonstrated.