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비이송식 플라즈마 토치 구조에 따른 열 플라즈마 특성 시험
정안목,전의식,Jeong, An-Mok,Jun, Euy-Sik 한국반도체디스플레이기술학회 2009 반도체디스플레이기술학회지 Vol.8 No.4
The influence on a stability of thermal plasma has been investigated in an electrode structure of non-transferred plasma torch. The variations of dynamic characteristic of the arc voltage was analyzed and compared in terms of voltage character and nozzle types for both the step-shaped nozzles and magnetic-approved cylindrical nozzle. From the experimental results, an electrode gap, flow rate of arc gas, and currents are considered as major operational parameters. As conclusion, it was assured that a torch with step-shaped nozzles of magnetic-approved type produce the stable plasma jet.
정안목 한국생산제조학회 2022 한국생산제조학회지 Vol.31 No.6
With the development of new alloys and composites, existing drilling techniques have technical constraints for machining difficult-to-cut materials. To overcome these constraints, researchers have developed various drilling methods, including ultrasonic-assisted drilling (UAD). An ultrasonic spindle with a 30 kHz resonant frequency was designed to apply UAD to hole processing. The resonance frequency and vibration mode were predicted using the finite element method (FEM), and a vibration nodal plane was selected. The resonance frequency and impedance characteristics of the ultrasonic spindle were determined using an impedance analyzer, and an error of approximately 1.9% was predicted using the FEM. Next, the vibration characteristics of the ultrasonic spindle were analyzed using a laser displacement system. The vibration displacement tests showed amplitudes of 39.7 and 0.5 μm at the end of the drilling tool and the nodal plane, respectively. The design validity of the manufactured ultrasonic spindle was demonstrated based on experimental drilling results.
300 mm 웨이퍼의 전영역 TTV 측정 정밀도 향상을 위한 모듈 설계
정안목,이학준 한국마이크로전자및패키징학회 2023 마이크로전자 및 패키징학회지 Vol.30 No.3
고대역폭 메모리(HBM)에 대한 수요가 증가하고 직경이 더 큰 웨이퍼의 핸들링 기술이 발전함에 따라 본딩 웨이퍼의 두께 균일성에 대해 신뢰성을 확보할 수 있는 측정 방법이 요구되고 있다. 본 연구에서는 300mm 웨이퍼를 대상으로 웨이퍼의 전 영역에 대해 TTV를 측정할 수 있는 모듈을 설계 제직하고, 측정 모듈의 설계를 바탕으로 발생할 수 있는 측정 오차를 분석하였으며, 웨이퍼의 처짐과 척의 기구적 오차를 고려한 모델 해석을 통해 예측된 기울기 값에 따른측정 오차를 추정하였다. TTV 측정 모듈은 웨이퍼 지지를 위한 센터 척과 리프트 핀을 활용하여 웨이퍼의 전체 영역에대해 측정이 가능하도록 하였다. 모달 해석을 통해 모듈의 구조적 안정성을 예측하였으며, 구동부와 측정부 모두 100Hz 이상의 강성을 갖는 것을 확인하였다. 설계된 모듈의 측정 오차를 예측한 결과 두께 1,500um의 본딩 웨이퍼를 측정할 경우 예측된 측정 오차는 1.34nm로 나타났다. As the demand for High Bandwidth Memory (HBM) increases and the handling capability of larger wafers expands, ensuring reliable Total Thickness Variation (TTV) measurement for stacked wafers becomes essential. This study presents the design of a measurement module capable of measuring TTV across the entire area of a 300mm wafer, along with estimating potential mechanical measurement errors. The module enables full-area measurement by utilizing a center chuck and lift pin for wafer support. Modal analysis verifies the structural stability of the module, confirming that both the driving and measuring parts were designed with stiffness exceeding 100 Hz. The mechanical measurement error of the designed module was estimated, resulting in a predicted measurement error of 1.34 nm when measuring the thickness of a bonding wafer with a thickness of 1,500 μm.
정안목,전의식,김철호 한국반도체디스플레이기술학회 2011 반도체디스플레이기술학회지 Vol.10 No.2
Ultrasonic welding is widely used in bonding of the same kind or dissimilar materials. The important variable of ultrasonic bonding is the bonding pressure, bonding time and applied amplitude energy. These variables have to be optimized in order to obtain the optimum bonding results. In this research, the important factor to optimal bonding between metal and glass were experimentally investigated by applying design of experiment.