http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
간섭계를 이용한 고온 환경에서 플립 칩 전자 패키지의 신뢰성 평가
박진형(Jin-Hyoung Park),장경운(Kyung-Woon Jang),백경욱(Kyung-Wook Paik),이순복(Soon-Bok Lee) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.5
Flip-chip assemblies using an adhesive have been increasingly applied to PDA devices, mobile phones and LCD devices. The use of Adhesive flip chip type electronic package offers numerous advantages such as reduced thickness and a low process temperature. ACF (anisotropic conductive film) type packages for flip-chip packages are becoming more popular among producers due to the simple processing involved, as well as the direct contact between the bump and electrode. Despite numerous benefits, flip-chip type packages bare reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycle damage and moisture absorption of the polymeric resin attributed to gradual delamination growth through chip and adhesive interface induced by CTE( coefficient of thermal expansion) mismatch driven shear and peel stresses. When the crack at a weak site of the electronic package occurs, thermal deformation of flip-chip package is changed.