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몰딩溫度와 時間이 彎曲 파티클 몰딩재의 物理的 및 機械的 性質에 미치는 영향
이필우(Phil Woo Lee),김영일(Young Ill Kim) 한국가구학회 1997 한국가구학회지 Vol.8 No.1
This study was carried out on the effect of molding temperature and time on physical and mechanical properties of curved particle moldings. Compression molded process was applied to phenolic resin and wood particle blends into curve shaped moldings. In order to manufacture curve shaped particle moldings, liquid type resin and 40~60 mesh size of wood particles were blended in the drum blender and poured into th<: cavity of heated mold. The method of molding was molding to stops which controls the thickness of moldings by stopper. The levels of 1I0"C, I30"C, 150'C, 170"C in molding temperature and 30sec/mm, 40sec/mm, 50sec/mm in molding time were applied to investigate molding properties.<br/> With the increase of molding temperature and time, the density of moldings was increased and the dimensional properties (water absorption, thickness swelling) were improved. MOR and hardness were increased while impact strength was decreased as molding temperature and time increase. Impact strength was shown maximum value in the range from 130'c to 150'c and decreased with increasing temperature over 150'c.<br/>
MDI(methylene diphenyl diisocyanate) 樹脂를 利用한 톱밥보드의 物性(I) - 보드 비중, 수지 첨가량, 매트 함수율에 관하여 -
이필우(Phil Woo Lee),윤형운(Hyoung Un Yoon) 한국가구학회 1994 한국가구학회지 Vol.5 No.2
1) 1) 1) This paper reports on the effects of mat moisture content(5%, 10%, 15%, and 20%, specific gravity(0.6, 0.7, 0.8, and 0.9), and resin(3%, 5%, 7%, and 9%) levels on physical and mechanical properties of MDI bonded- sawdust board.<br/> As mat moisture content increased, MOR and MOE increased and dimensional stability improved as a whole. Therefore, we considered that MDI resin can be used at high moisture content level(20%) without longer press time. As increasing of specific gravity, MOR, MOE and IE increased but water absorption and linear expansion decreased. Thickness swelling has no change with specific gravity levels. As increasing of resin level, MOR, MOE and IE increased linearly but thickness swelling and water absorption decreased.<br/> It was shown that in the case of sawdust board bonded with MDI resin, the same properties obtain approximately from a quarter level of urea formaldehyde resin added.<br/> The physical and mechanical properties of sawdust board bonded at MD I resin level of 7% or more were equivalent to those of conventional urea bonded particleboard. but, because of high price of MDI binder, the application of MDI resin to particleboard will be impossible to use with same level of sawdust board added at this study. Further research and development will focused on determining appropriate uses like as comply or molded products types in use of sawdust with MDI resin.<br/>