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윤한기(Han Ki Yoon),이진경(Jin Kyung Lee),오정석(jung Seok Oh),손수정(Soo Jung Shon),H. Takanashi 대한기계학회 2014 대한기계학회 춘추학술대회 Vol.2014 No.5
This work is to scope potentiality of solid state bonding for SiC and W and to define key mechanism to make high temperature components satisfy their requirements. The preliminary result indicated the potential of the method as fabrication process of SiC and W high temperature system component. In this study, we investigate the microstructure mechanism, two types of reaction layer between W and SiC of interphase structure.