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Pulse-reverse도금을 이용한 다층 PCB 빌드업 기판용 범프 생성특성
서민혜,공만식,홍현선,선지완,공기오,강계명,Seo, Min-Hye,Kong, Man-Sik,Hong, Hyun-Seon,Sun, Jee-Wan,Kong, Ki-Oh,Kang, Kae-Myung 한국재료학회 2009 한국재료학회지 Vol.19 No.3
Micro-scale copper bumps for build-up PCB were electroplated using a pulse-reverse method. The effects of the current density, pulse-reverse ratio and brightener concentration of the electroplating process were investigated and optimized for suitable performance. The electroplated micro-bumps were characterized using various analytical tools, including an optical microscope, a scanning electron microscope and an atomic force microscope. Surface analysis results showed that the electroplating uniformity was viable in a current density range of 1.4-3.0 A/$dm^2$ at a pulse-reverse ratio of 1. To investigate the brightener concentration on the electroplating properties, the current density value was fixed at 3.0 A/$dm^2$ as a dense microstructure was achieved at this current density. The brightener concentration was varied from 0.05 to 0.3 ml/L to study the effect of the concentration. The optimum concentration for micro-bump electroplating was found to be 0.05 ml/L based on the examination of the electroplating properties of the bump shape, roughness and grain size.