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허니컴 샌드위치 평판 형상에 따른 열전도율 예측 및 전산해석적 연구
홍석민(Seok-min Hong),남기훈(Ki-hoon Nam),이장일(Jang-il Lee),최영돈(Young-don Choi),류인근(In-keun Ryu) 대한기계학회 2012 대한기계학회 춘추학술대회 Vol.2012 No.11
Thermal problem that is directly related to the lifetime of electronic device is becoming increasingly important due to the miniaturization of electronic device. In order to solve these problems, thermal stability studies through the thermal diffusivity and insulation are required. In this study, thermal conductivity coefficient were derived respectively for Cartesian coordinates x, y, z, depending on the honeycomb shape. Dimensionless number β is defined as the average length and thickness ratio, then predicted the changes of thermal conductivity coefficients depending on the β. Experiment and computational analysis are carried out using honeycomb sandwich plate specimen with area (100 × 100 ㎟) and heat source of about 5W power with area (14 × 18 ㎟). The validity of the proposed correlations is confirmed and the honeycomb sandwich plate’s thermal performance be evaluated in this study.