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RISS 인기검색어
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- 저자 : Junghoon Choi(최정훈) (검색결과 13 건)
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GaN-on-Si 기술을 위한 탄화텅스텐 버퍼층의 성장에 관한 연구
조성민,최정훈,최성국,조영지,이석환,장지호,Cho, Sungmin,Choi, Junghoon,Choi, Sungkuk,Cho, Youngji,Lee, Seokhawn,Chang, Jiho 한국전기전자재료학회 2017 전기전자재료학회논문지 Vol.30 No.1
Tungsten carbide (WC) has been suggested as a new buffer layer for the GaN-on-Si technology. We have investigated and optimized the sputtering condition of WC layer on the Si-substrate. We confirmed the suppression of the Si melt-back phenomenon. In addition, surface energy of WC/Si layer was measured to confirm the possibility as a buffer layer for GaN growth. We found that the surface energy(${\gamma}=82.46mJ/cm^2$) of WC layer is very similar to that of sapphire substrate(${\gamma}=82.71mJ/cm^2$). We grow GaN layer on the WC buffer by using gas-source MBE, and confirm that it is available to grow a single crystalline GaN layer.
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합성 불산화 이트륨 분말을 이용한 DLP 3D 프린팅용 광경화성 슬러리 제조
김은성,한규성,최정훈,김진호,김응수,Kim, Eunsung,Han, Kyusung,Choi, Junghoon,Kim, Jinho,Kim, Ungsoo 한국재료학회 2021 한국재료학회지 Vol.31 No.9
In this study, a spray dryer is used to make granules of Y<sub>2</sub>O<sub>3</sub> and YF<sub>3</sub>, and then Y<sub>5</sub>O<sub>4</sub>F<sub>7</sub> is synthesized following heat treatment of them under Ar gas atmosphere at 600 ℃. Single and binary monomer mixtures are compared and analyzed to optimize photocurable monomer system for DLP 3D printing. The mixture of HEA and TMPTA at 8:2 ratio exhibits the highest photocuring properties and low viscosity with shear thinning behavior. The optimized photocurable monomer and synthesized Y<sub>5</sub>O<sub>4</sub>F<sub>7</sub> are therefore mixed and applied to printing process at variable solid contents (60, 70, 80, & 85 wt.%) and light exposure times. Under optimal light exposure conditions (initial exposure time: 1.2 s, basic exposure time: 5 s), YOF composites at 60, 70 & 80 wt.% solid contents are successfully printed. As a result of measuring the size of the printed samples compared to the dimensions of the designed bar type specimen, the deviation is found to increase as the YOF solid content increases. This shows that it is necessary to maximize the photocuring activity of the monomer system and to optimize the exposure time when printing using a high-solids ceramic slurry.
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점용접의 해석 모델 개발 및 용접조건에 대한 영향도 분석
방혜진(Hyejin Bang),주용현(Yonghyun Ju),최정훈(Junghoon Choi),신현식(Hyunshik Shin),정병성(Byungsung Jung),박규종(Kyujong Park),이상교(Sang-kyo Lee),조종두(Chongdu Cho) 한국자동차공학회 2015 한국 자동차공학회논문집 Vol.23 No.6
Resistance Spot Welding (RSW) is the method for joining two overlapped base materials when high pressure and current is applied from electrodes. Due to the safety problem such high pressure and voltage, automation should be early adopted. In this paper, the spot welding is developed as a computational model of wheel house from GM Korea and the welding condition such as weld sequence is considered. The computational analysis is preceded as a static and elasto-plastic procedure and used thermal expansion coefficient represents a dependency of spot volume between two panels. In case of welding sequence, the efficiency which depends on the distance between current spot point and the other is calculated in several cases.
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