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최승준(Seungjune Choi),양성모(Sungmo Yang),유효선(Hyosun Yu),권정수(Jeongsu Kwon) 한국자동차공학회 2015 한국자동차공학회 부문종합 학술대회 Vol.2015 No.5
As the demand of a pickup truck, the demand of crane for pickup truck is increasing as well. Although the crane for pickup truck have developed a lot but small crane developed with domestic technology does not exist. Boom was designed as a high-tensile steel in ATOS80. The full stretch at maximum stress showed that receive 16% load more than minimum stretch. The wind moment was applied when calculating the wind load of the boom moment and considering moving situation, we applied a dynamic load factor. Also safety factor that calculated by using a variety of safety standard is found to be 3.29 to 2.85.
고용량 리튬전지를 위한 음극집전체 신뢰성향상 방안에 대한 연구
최승준(Choi, SeungJun) 대한기계학회 2021 대한기계학회 춘추학술대회 Vol.2021 No.4
리튬 전지의 음극집전체로 사용되는 동박의 신뢰성 향상방안에 대해서 논하고자 한다. 최초 리튬 이온 전지가 대두되었을 때 12 um 수준의 전지용 동박이 그 두께를 줄여가면서 발생되었던 문제에 대해서 고찰하였다. 고용량 리튬 2 차 전지 개발을 위하여 극박화되는 동박이 가져야할 특성과 이 특성을 향상시키기 위하여 어떠한 신뢰성 향상 기술을 적용했는지와 향후 극복해야할 과제에 대해서 정리하였다. 향후 개발되어야 하는 음극집전체가 가져야할 특성과 기술개발 방안에 대해 서술하였다. This paper explains how to improve reliability copper foil for Lithium ion battery. In initial stage of developing lithium ion battery, 12 um thickness of copper foil wa used as a current collector. This paper explains problems duringdeveloping thinner copper foil for high performance lithium ion battery. Various Characteristics of copper foil for lithium ion battery is summarized in this paper. Also the technical method to overcome problems occurred during development is introduced. This paper predicts the trends for developing copper foil for high performance lithium ion battery.
리플로우 시간에 따른 Sn-4Ag 솔더접합부 FEM 전단해석
유효선(Hyosun Yu),양성모(Sungmo Yang),손인덕(Indeok Son),최승준(Seungjun Choi) 한국자동차공학회 2015 한국자동차공학회 부문종합 학술대회 Vol.2015 No.5
The evaluation on reliability of environment-friendly Pb-free solder and solder joints is very important. The correlation between interface reaction and mechanical properties of solder joints was confirmed in this study. And shear test are performed using SP(Share-Punch) tester. The shear strength tests on various reflow time are performed at 10,30,00 and 300sec. Tested specimens were examined in order to observe the failure mode on solder joints. The test result about solder joints of two different plate(Ni and Cu plate) are compared. Ni plate joints shown low IMC growth rate. The shear strength of Pb-free solder joints are higher than Sn-37 Pb solder joints, generally. In the case of Cu plate, shear strength of Sn-4Ag solder joints increased with reflow time. And solder joints with Cu contents are seems to similar in strength regardless of reflow time. on the other hand, in the case of Ni plate joints, shear strength of Sn-37Pb solder joints are similar to Sn-4Ag solder joints. Like Cu plate joints, solder joints with Cu contents are seems to similar in strength regardless of reflow time.