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주강우,이윤철,이영식,손정종,이재권,김광선 한국반도체디스플레이기술학회 2016 반도체디스플레이기술학회지 Vol.15 No.1
This paper is about the analysis on the vibration characteristic of tooling units on the precision automatic lathe. The vibration characteristic of the machine tool is emphasized in accordance with the high precision of the various industries Including the various semiconductor devices and components sector. In this paper, the vibration analysis was performed in designed tooling units of precision automatic lathe. Through the analysis, it is calculated that the frequency of distribution in certain areas by review the resonant frequency and the amount of deformation. And designed model was verified to be a stable structure.
주강우,이재경,이봉건,윤혜준,김광선 한국반도체디스플레이기술학회 2015 반도체디스플레이기술학회지 Vol.14 No.1
This paper is on the design and manufacturing of vibration tester (shaker) for experiments about effects on the performance of semiconductor chips and Li-ion batteries by vibration. Shaker in the market are quite expensive, it is difficult for basic researchers to contact. In this study, in order to improve this, we designed and manufactured with an entry-level into mass production possible approaches in terms of performance required to a minimum. The shaker system is operated by Matlab and LabView. The target performances are 200Hz frequency and 5% error, and these were satisfied.
주강우,장경민,김광선 한국반도체디스플레이기술학회 2015 반도체디스플레이기술학회지 Vol.14 No.1
This paper is to derive information about the optimal shape of the pack has a minimum temperature range of a Li-ion battery equipped with a module. We selected the shape of the pack in order to reduce the temperature deviation between the batteries as a variable. And we derived the experimental points with a minimum of DOE by D-optimal. We analyzed the temperature and the flow within the battery pack by using a numerical analysis verified in previous studies. We derive the equation for the temperature variation in the objective function using the RSM and performed optimization. As a result, it was confirmed that with the variation in the 1.706e-4 ℃ when to apply an optimized shape.
리튬이온 배터리의 정확한 잔량 측정 기술개발을 위한 연구 방향 제안
주강우,이윤철,하주환,김광선 한국반도체디스플레이기술학회 2016 반도체디스플레이기술학회지 Vol.15 No.2
More efficient use of the battery pack is dependent upon how to measure the remaining capacity of the battery accurately. Among various measurement methods, the basic correction measurement method has still been a hot research topic area to reduce the errors. In this paper, the problems of the existing methods have been investigated and the research direction for measuring more accurate remaining capacity has been suggested by applying the numerical simulations in the future.
반도체용 저온 열처리로의 Flat Zone 확장 및 온도편차 감소에 관한 연구
주강우,심승술,장혁,이유영,김광선 한국반도체디스플레이기술학회 2014 반도체디스플레이기술학회지 Vol.13 No.4
This paper is about the yield rate of lower temperature furnace for wafer heat-treatment. The flat-zone that the temperature in furnace has uniform distribution specific area is the significant variable to the yield rate. In this study, we researched about the ways how to widen the flat zone in the furnace using CFD. As a result, we confirmed that the characteristic of the flat-zone was changed when SCU(Super Cooling Unit) was used. We considered temperature control with above.
禹志亨,朱鋼 단국대학교 1984 論文集 Vol.18 No.-
In order to increase in preventing effect from delivered eight kinds of microorganism, seven kindes of testing swatch, cotton, viscose rayon, acetate rayon, wool, polymide, polyester and polyacrylonitrile, are treated by five kinds of antimicrobial agents-BAC, THP, TAM, bis-T-b and TAS-. The results are as follows... 1) Alkyldimethyl benzylammonium "BAC" is good for preventing cotton and viscose rayon swarches from microbial and mildew, but decrease washing stability after over ten times washing. Blending with acrylic resin and curing treatments is good for preventing power against microbial and mildew when tested after over twenty times washing . 2) Bis (tri-n-butyl) "bis-T-b" is presented good for preventing polyamide and polyacrylonitrile samples from microbial and mildew, moreover, it is presented remarkable preventing power after over thirty times washing. But, it is required treating this material for our healthy. 3) 2,4,4^'-trichloro-2^'-hydroxy diphenyl ether "THP" is presented good for preventing power against microbial and mildew. Furthermore, it is presented remarkable record for preventing power against becilli by Halo testing. 4) 1-(3-chloroally)-3,5,7-triaza-1-azo-niaadamantane chloride "TAM", a good preventing power against microorganism but weak coherence with textiles, is good spinned with spinning emulsion for regenerated fiver, 5) "TAS" is presented ninethy six percentage of decreasing bacilli rate after thirty times washing samples.
김준영,주강우,윤종국,유선중,김광선 한국반도체디스플레이기술학회 2011 반도체디스플레이기술학회지 Vol.10 No.4
The recent PCB (Printed Circuit Board) wet etcher has been needed to process pattern within 20μm width on a 40μm-thick board. A previous PCB etcher can be used with multiple points of roller rolls or slips off a board. Also, the damage of the board by contacting the roller increases the friction defects. A vertical type boards transporting process is developed to solve the problems of boards friction and sagging in a horizontal etcher. In this research, CFD (Computational Fluid Dynamics) method is used to design an improved spray nozzle including the critical part of etcher, and establish the design method. Meanwhile, major spray characteristics are expected in diverse nozzle types and variables. Lastly, diverse simulation results are adapted to design an improved nozzle and spray system.
정밀가공용 고속 자동선반 베드의 정하중 및 공진주파수 해석
하주환,이윤철,주강우,조은정,이영식,이재권,김광선 한국반도체디스플레이기술학회 2017 반도체디스플레이기술학회지 Vol.16 No.2
This paper is about the analysis on the vibration characteristic of tooling units on the precision bed in high-speed automatic lathe for precision machining. An automatic lathe operating at about 25,000 RPM is a critical factor in the self-weight stress and deformation of the bed. Especially, the resonance frequency should be grasped in advance to prevent abnormal vibration that may occur during processing. If the wrong bed is used, the resonant frequency can have a fatal influence on the precision machining and increase the defective rate of precision machined parts such as semiconductor parts. In this paper, vibration characteristics were evaluated through static load and resonance frequency analysis of automatic lathe bed. As a result, the maximum stress was 0.14MPa, the maximum deformation amount was 17.9μm, and the natural frequency was 364.72Hz. The resonance frequency was calculated as 718Hz, and the stability was confirmed by being in the range of 400Hz or more, which is the processing condition.
피난 시뮬레이션을 이용한 피난 유도 시스템의 성능 평가
김준영,하주환,주강우 한국화재감식학회 2018 한국화재감식학회 학회지 Vol.9 No.3
In the case of a fire or disaster in a high-rise building, the efficiency of the evacuation and the need for preventive construction are increasing due to various problems. As seen in many large accidents, the damage caused by the maze was complicated by the complicated structure and uncertain distance. The most important thing here is to allow the occupants to evacuate quickly and safely. Therefore, in this study, considering the evacuation guidance system guiding the optimal evacuation route through the fire detection facility and the evacuation guidance light, the high - rise building of the KOREATECH And the time required to evacuate is estimated through simulations.
김광선,김준영,장경민,주강우 한국반도체디스플레이기술학회 2013 반도체디스플레이기술학회지 Vol.12 No.4
In the semiconductor heat-treatment process, the temperature uniformity determines the film quality of a wafer. This film quality effects on the overall yield rate. The heat transfer of the wafer surface in the heat-treatment process equipment is occurred by convection and radiation complexly. Because of this, there is the nonlinearity between the wafer temperature and reactor. Therefore, the accurate prediction of temperature on the wafer surface is difficult without the direct measurement. The thermal camera and the T/C wafer are general ways to confirm the temperature uniformity on the heat-treatment process. As above ways have limit to measure the temperature in the precise domain under the micro-scale. In this study, we developed the thin film type temperature sensor using the MEMS technology to establish the system which can measure the temperature under the micro-scale. We combined the experiment and numerical analysis to verify and calibrate the system. Finally, we measured the temperature on the wafer surface on the semiconductor process using the developed system, and confirmed the temperature variation by comparison with the commercial T/C wafer.