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플립칩에서 솔더볼의 매개변수 변화에 따른 동적 해석 평가
김성걸(Kim SeongKeol),김한중(Kim HanJung),임승영(Lim SeungYoung),김순영(Kim SoonYoung),양인영(Yang InYoung),안은진(An EunJin) 한국생산제조학회 2010 한국공작기계학회 추계학술대회논문집 Vol.2010 No.-
Drop impact reliability assessment of solder joints on the Flip chip is one of the critical issues for growing use in the handheld products and environmental concerns. Our previous research has been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, Dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop reliability. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.2Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder bumps. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.