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Shallow Trench Isolation 공정에서 수분에 의한 nMOSFET의 Hump 특성
이영철,Lee, Young-Chul 한국정보통신학회 2006 한국정보통신학회논문지 Vol.10 No.12
In this parer, hump characteristics of short-channel nMOSFETs induced by moistures of the ILD(inter-layer dielectric) layer in the shallow trench isolation (STI) process are investigated and the method for hump suppression is proposed Using nMOSFETs with various types of the gate and a measurement of TDS-APIMS (Thermal Desorption System-Atmospheric Pressure ionization Mass Spectrometry), hump characteristics were systematically analyzed and the systemic analysis based hump model was presented; the ILD layer over poly-Si gate of nMOSFET generates moistures, but they can't diffuse out of the SiN layer due to the upper SiN layer. Consequently, they diffuses into the edge between the gate and STI and induces short-channel hump. In order to eliminate moisture in the ILD layer by out-gassing method, the annealing process prior to the deposition of the SiN layer was carried out. As the result, short-channel humps of the nMOSFETs were successfully suppressed. 본 논문은 shallow trench isolation (STI) 공정에서 ILD (inter-layer dielectric) 막의 수분에 의해 야기되는 단 채널 (short-channel) nMOSFET의 hump 특성의 원인을 분석하고 억제 방법을 제안하였다. 다양한 게이트를 가지는 소자와 TDS-APIMS(Thermal Desorption System-Atmospheric Pressure Ionization Mass Spectrometry) 측정을 이용하여 hump 특성을 체계적으로 분석하였고, 분석을 바탕으로 단 채널 hump모델을 제안하였다. 제안된 모델에 의한 단 채널 nMOSFET의 hump 현상은 poly-Si 게이트 위의 ILD 막의 수분이 상부의 SiN 막에 의해 밖으로 확산되지 못하고 게이트와 STI의 경계면으로 확산하여 발생한 것이 며, 이를 개선하기 위해 상부의 SiN 막의 증착 전 열공정을 통해 ILD 막의 수분을 효과적으로 배출시킴으로써 hump 특성을 성공적으로 억제하였다.
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이영철,Lee, Young-Chul 한국전자파학회 2006 한국전자파학회논문지 Vol.17 No.11
본 논문에서는 저온 소성 세라믹(LTCC)에 기초한 SiP 기술을 이용하여 60 GHz 무선 통신을 위한 송신기용 초소형 전력 증폭기 LTCC모듈을 설계 및 제작하여 그 특성을 측정하였다. 60 GHz대역에서 LTCC 다층 기판과 전력 증폭기 MMIC의 상호 연결 손실을 줄이기 위해 와이어 본드와 기판 사이의 천이를 최적화하였고, MMIC 집적을 위한 고 격리 구조를 제안하였다. 와이어 본드 천이의 경우, 와이어의 인덕턴스를 감소시키기 위해 매칭 회로의 설계와 와이어 상호간의 간격을 최적화하였다. 또한 상호 연결 불연속 효과로 인한 전계의 방사를 억제하기 위해 코프라나 와이어 본드 구조를 이용하였다. 고 격리 모듈 구조를 위하여, LTCC 기판 내부에 DC 전원 배선을 내장시키고 비아로 그 주위를 차폐를 시켰다. 5층의 LTCC 기판을 사용하여 제작된 전력 증폭기 LTCC모듈의 크기는 $4.6{\times}4.9{\times}0.5mm^3$이고, $60{\sim}65GHz$ 대역에서 이득과 P1dB 출력 전력은 각각 10 dB와 11 dBm이다. In this paper, using low-temperature co-fired ceramic(LTCC) based system-in-package(SiP) technology, a very compact power amplifier LTCC module was designed, fabricated, and then characterized for 60 GHz wireless transmitter applications. In order to reduce the interconnection loss between a LTCC board and power amplifier monolithic microwave integrated circuits(MMIC), bond-wire transitions were optimized and high-isolated module structure was proposed to integrate the power amplifier MMIC into LTCC board. In the case of wire-bonding transition, a matching circuit was designed on the LTCC substrate and interconnection space between wires was optimized in terms of their angle. In addition, the wire-bonding structure of coplanar waveguide type was used to reduce radiation of EM-fields due to interconnection discontinuity. For high-isolated module structure, DC bias lines were fully embedded into the LTCC substrate and shielded with vias. Using 5-layer LTCC dielectrics, the power amplifier LTCC module was fabricated and its size is $4.6{\times}4.9{\times}0.5mm^3$. The fabricated module shows the gain of 10 dB and the output power of 11 dBm at P1dB compression point from 60 to 65 GHz.
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반복 금형주조용 자동 금형냉각장치 개발 및 적용 1 : 용탕충진거동 및 응고해석
이영철,이상목,최정길,홍준표 ( Young Chul Lee,Sang Mok Lee,Jeong Kil Choi,Chun Pyo Hong ) 한국주조공학회 1998 한국주조공학회지 Vol.18 No.2
N/A A three dimensional simulation program based on the SOLA-VOF technique was developed for the modeling of mold filling and solidification sequences of the AC4B alloy in the cyclic permanent mold casting process. The geometries and mesh diagrams of the casting and the mold were automatically generated using a pre-processor based on the commercial Auto-CAD system. The solidification time of the casting and the temperature variation of the mold with cyclic casting were evaluated using the present scheme. The effects of the local water cooling of the metal mold on the cyclic casting process were also examined in order to control the temperature variation in the mold and to improve the soundness of the castings. The minimization of the casting cycle time was also confirmed by the present program for an improved productivity. It can be concluded that the present program can be used for obtaining the optimum casting parameters and the local cooling condition for obtaining sound castings without shrinkage defects in the cyclic mold casting process. (Received March 2, 1998)
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이영철,이두호,김종기,소찬영,최정길,홍준표 ( Young Chul Lee,Doo Ho Lee,Jong Ki Kim,Chan Young So,Jeong Kil Choi,Chun Pyo Hong ) 한국주조공학회 1997 한국주조공학회지 Vol.17 No.5
N/A An integrated computer program consisting of a pre-processor, main solver, and post-processor was developed for the design of large steel castings. The pre-processor, based on the AutoCAD, enables the user to produce approval drawings, casting design drawings and mesh diagrams in sequence using a personal computer. In the main solver, two numerical models were employed; one models the fluid flow during mold filling, and the other models the heat transfer and solidification. The post-processor can be used to present simulation results such as flow pattern, mold filling sequences, solidification times, temperature gradients and location of shrinkage defects by color graphics. In order to validate the applicability of the present integrated program, a series of experiments on simple-shaped steel castings were carried out. After the validation of the present model, it was applied to the casting design of the large steel anchor of an SC42 alloy. Various solidification parameters such as a temperature distribution and a solidification time in the casting and the mold were compared with those obtained experimentally. Simulated results predicting shrinkage defects were in good agreement with those obtained experimentally. It was found that the present method can be successfully applied to the quantitative casting design for complex-shaped large steel castings. (Received June 4, 1997)
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